LTE reference architectures lower overall cost and accelerate time-to-market for semiconductor vendors and OEMs
MOUNTAIN VIEW, Calif. -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and mimoOn, the leading licensor in LTE software implementation for programmable radio platforms, announced today a range of LTE reference architectures based on the widely adopted CEVA-XC communication processor and designed to accelerate the development of cost-efficient, low-power 4G solutions for mass market terminal and infrastructure devices. The reference architectures are software upgradeable to support additional wireless communication standards such as WCDMA, HSPA+ and WiMAX.
The User Equipment (UE) reference architecture targets both LTE FDD and LTE TDD up to category-4 with ultra-low power consumption and silicon cost to meet the strict requirements of mobile devices. Furthermore, the solution can be easily scaled down to TDD mode only or lower LTE categories to offer an additional cost and power saving. In 40nm LP process, the silicon area of a CEVA-XC based LTE UE can be as low as 4mm2 with a power consumption of less than 200mW for Cat-4 PHY system (20 MHz bandwidth, MIMO 2x2, 150 Mbit/sec). CEVA and mimoOn's UE solution, which is now in design with a leading wireless vendor, can be seen at CEVA's booth located at stand 1F33 in Hall 1 at Mobile World Congress from 14th to 17th of February. mimoOn are located at pavilion #99 on the main avenue.
The scalable eNodeB reference architecture targets both LTE FDD and LTE TDD, supporting various end products ranging from residential and enterprise femtocells through to high-density picocells. This reference architecture is built around homogenous CEVA-XC processors requiring minimal hardwired logic, allowing easy processor load balancing, flexibility to support multiple wireless communication standards, and C-based software development. In addition, this architecture allows simple software migration from off-the-shelf wireless infrastructures DSP chips.
According to Brian Robertson, VP Sales & Marketing of mimoOn, "Our partnership with CEVA for the development of LTE reference architectures for UE and eNodeB applications is the result of two years close collaboration and serves to meet the industry demand for licensable LTE solutions that offer significant cost and time-to-market benefits. The flexibility of the architectures will prove very appealing to customers targeting mass market LTE devices, by enabling reuse of the architecture to support different use cases, through software."
Eran Briman, vice president of marketing at CEVA commented: "Through our partnership with mimoOn, we are able to offer our customers complete and highly optimized LTE PHY reference architectures for a range of high volume 4G products, including handsets, data modems, femtocells and picocells. Working closely with mimoOn and leveraging on our experience with mutual customers allows us to offer real-life reference architectures that are well-established and production-ready for such end-products."
With seven of the world's top eight handset OEMs shipping CEVA-powered baseband processors today, CEVA's DSP technology powers one out of every three handsets worldwide. Addressing next-generation 4G terminal and infrastructure markets, CEVA's latest generation DSP, the CEVA-XC has been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces in software, including LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.
mimoOn GmbH, headquartered in Dusseldorf, Germany, is a world leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile phones and devices, small cell basestations (Pico/Femto) and IP development in the area's of SON, schedulers and Radio Resource management.
mimoOn partners with leading silicon & DSP IP vendors, providing a complete HW & SW platform for OEM's to develop and commercialise their products. mimoOn provides a complete porting, optimisation and verification service, as well as a roadmap to future 3GPP releases. For more information, visit www.mimoOn.de.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
CONTACT: Richard Kingston of CEVA, Inc., +1-650-417-7976, firstname.lastname@example.org; or Mike Sottak of Wired Island, Ltd., +1-408-876-4418, email@example.com