Center Probe Test Socket facilitates device burn-in.

Press Release Summary:



Accommodating devicea 6.5 mm or smaller, high-frequency center probe test socket is suited for use with test and dynamic burn-in of CSP/MicroBGA/DSP/LGA/SRAM/DRAM/Flash devices. Socket is comprised of compression spring probes made of heat-treated beryllium-copper alloy plated with 0.75 µm gold per Mil-G-45204 over 0.75 µm nickel per SAE-AMS-QQ-N-290. Spring probes feature contact forces of 15 g/contact on 0.30-0.35 mm pitches, 16 g on 0.40-0.45 mm pitches, and 25 g on 0.50 mm pitches or larger.



Original Press Release:



Aries Electronics' New 6.5 mm Center Probe Test Socket Features Versatile Design Ideal for Test and Burn-In



Bristol, Pa. October 2008 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new high-frequency center probe test socket comprised of a standard molded format that enables the socket to accommodate any device 6.5 mm or smaller. With the new device compatibility, Aries' versatile center probe test socket is suitable for use with test and dynamic burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.

Aries' center probe test socket offers machined pressure pads and interposers ideal for use in small quantities and custom molded pressure pads and interposers for large quantities. The socket's pressure pad compression spring also allows for height variation in device thickness and provides proper force against the device.

The socket features solderless pressure mount compression spring probes, which are accurately located by two molded plastic alignment pins. The socket can be easily mounted to and removed from the printed circuit board (PCB) using two stainless steel mounting screws. With operator-friendly mounting and removing, the spring probes also leave very small witness marks on the bottom of the device solder balls.

Aries' new center probe test socket is comprised of compression spring probes made of heat-treated Beryllium-Copper alloy plated with 30 µ" min. (0.75 µ) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per SAE-AMS-QQ-N-290. The molded socket components are UL94V-0 Ultem. The sockets' spring probes feature contact forces of 15 g per contact on 0.30 mm to 0.35 mm pitches, 16 g per contact on 0.40 mm to 0.45 mm pitches, 25 g per contact on 0.50 mm pitches or larger.

The test socket benefits from <40 milliohms of contact resistance, an operating temperature of -55°C to 150°C (-67°F to 302°F) and a contact life of an estimated 500,000 cycles minimum, which enable the user to implement the socket in an array of applications as well as provide ease of use without the need for frequent replacements.

As with all Aries sockets, the new center probe test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for a 100 lead socket starts at $125.00. Delivery is 20 working days ARO.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: www.arieselec.com, Data sheet #24013 - www.arieselec.com/products/24013.pdf.
Europe Email: europe@arieselec.com.

READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.

UPCOMING TRADESHOW: electronicAsia, Wanchai, Hong Kong, October 13-16, 2008

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