Capillary suits demanding packaging applications.

Press Release Summary:

Arcus(TM) capillary provides accurate looping in stacked die, quad-tier, and other complex, tight tolerance devices. It also minimizes defects in wire bonding process, such as wire kinks, wire sag, wire sweep, and wire leaning.

Original Press Release:

New Capillary from Kulicke & Soffa Increases Production Yields In Demanding Applications

WILLOW GROVE, PA, July 12, 2005 -- Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) has developed a new capillary called Arcus(TM) to increase yields and productivity in demanding packaging applications. Specifically, this new capillary provides more accurate and reliable looping in stacked die, quad-tier and other complex, tight tolerance devices. Compared to the looping performance of other conventional capillaries, the new Arcus significantly decreases defects in the wire bonding process, such as wire kinks, wire sag, wire sweep and wire leaning. Initial data from customers shows that this capillary offers faster looping formations and a very stable process, with less scrap and overall higher UPH.

Dr. Ilan Hadar, vice president of K&S Materials Business Units states, "Our motivation for developing Arcus came from customer input to resolve looping issues that have significantly affected yield lost lately. The Arcus capillary provides more advanced bonder looping parameters to eliminate many of the looping defects that occur when bonding today's complex packages." He further states, "K&S has seen tremendous advancements with this new capillary, especially in the areas of ultra-low or high loops, long wire span, special loop profiles and difficult trajectories. The K&S long-term strategy is to support yield and productivity improvement in the wire bonding process. Our Nexxus capillary pioneered that trend, with ARCUS providing a natural extension to address the issues related to optimizing productivity for today's more complex, multi-tiered applications."

Jack Belani, senior vice president, K&S Wire Bonding and Corporate Marketing, explains, "Our Arcus capillary was specifically designed to enhance the looping quality on complex applications where our customers know that looping control is vital." He further explains, "This new technology, which was developed in our advanced Capillary Manufacturing Center in Israel, was achieved through joint studies with our customers who look to us for technological innovations in the areas of capillaries, bonding wire and wire bonders."

Now in full production at two K&S manufacturing facilities, the Arcus capillary is being shipped to contractors and IDMs around the world. For more information on the Arcus capillary, visit our web site at or contact Mark Sullivan at

About K&S
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor wire bonding assembly equipment. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor wire bonding equipment along with the complementing packaging materials and test interconnect products that actually contact the surface of the customer's semiconductor devices. The ability to control all of these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Test interconnect products include a variety of wafer probe cards, ATE interface assemblies, and ATE boards for wafer testing, as well as test sockets for all types of packaged semiconductor devices. Kulicke & Soffa's web site address is

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