Cadence RAK for ARM Cortex-M23 and Cortex-M33 processors.

Press Release Summary:

Creating low-power ARM Cortex-M23 and Cortex-M33 processors, Cadence’s Rapid Adoption Kit address the development of secure IoT rapidly and efficiently. Consisting of end-to-end digital implementation and signoff flow, RAK enables quick silicon delivery of ARM-based applications. Features optimal power, performance and area, fast runtimes and efficient design closures and implementation of IoT devices.

Original Press Release:

Cadence Enables Accelerated Implementation and Signoff of New ARM Cortex-M23 and Cortex-M33 Processors

Cadence delivers RAK for new ARM Cortex-M23 and Cortex-M33 CPUs targeted for the development of secure, energy-efficient IoT applications including health monitoring, smart lighting and streamlining logistics applications

RAK incorporates the latest Cadence digital implementation and signoff technologies to enable designers to meet challenging PPA goals

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of a Cadence® Rapid Adoption Kit (RAK) for the new ARM® Cortex®-M23 and Cortex-M33 processors targeted for the development of secure Internet of Things (IoT) applications. The Cadence RAK consists of a complete digital implementation and signoff flow that designers can utilize to create low-power Cortex-M23 and Cortex-M33 devices quickly and efficiently, thereby enabling early silicon delivery. For more information on Cadence solutions for ARM-based applications, please visit

The new Cadence RAK lets customers using the new Cortex-M23 and Cortex-M33 CPUs:
• Experience a quick path to implementation via a full-flow digital and signoff reference methodology that provides optimal power, performance and area (PPA). The methodology incorporates the Cadence Genus™ Synthesis Solution, Innovus™ Implementation System, Quantus™ QRC Extraction Solution, Tempus™ Timing Signoff Solution, Modus™ Test Solution and multiple Conformal® products

• Achieve fast runtimes and efficient design closure through the integrated Cadence multi-mode, multi-corner RTL-to-GDS flow, including the GigaPlace™ Engine for power domain-aware placement, CCOpt™Optimizer for low-power clock distribution and Tempus Timing Signoff Solution for final signoff-driven design closure to reduce total power

• Implement IoT devices using the complete Cadence low-power, multiple-power-domain flow using IEEE 1801 standard constraints, multi-bit cell insertion and the GigaOpt™ Optimizer for dynamic and leakage power optimization in the Innovus Implementation System.

"To deliver on the full potential of IoT, we need innovative, secure and optimized embedded solutions that can be rapidly delivered from concept to market," said Nandan Nayampally, vice president of marketing and strategy, CPU Group, ARM. "Our new ARM Cortex-M23 and Cortex-M33 processors are designed to provide a secure, energy-efficient foundation for the most constrained IoT applications. The latest Cadence RAK will support customers using these cores, enabling them to enhance their development environments to quickly differentiate themselves with ultra low-power IoT devices."

"We worked closely with ARM to optimize our advanced digital implementation and signoff solutions with the ARM Cortex-M23 and Cortex-M33 processors, so our customers can start creating innovative, connected IoT designs immediately," said Dr. Anirudh Devgan, senior vice president and general manager of the Digital & Signoff Group and the System & Verification Group at Cadence. "Designers using the RAK can adopt our technologies with confidence while also benefiting from reduced turnaround times."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at

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