Bridge Chip is compact for limited space applications.

Press Release Summary:

Single-port uPD720405 PCI Express-to-PCI/PCI-X bridge chip is available in 17 x 17 mm BGA that fits in cards with heights as low as 64.41 mm. Featuring 2 W power consumption, chip is designed for networking and storage applications in workstation and motherboards. Operating at 133 MHz in single data rate PCI-X mode or 66 MHz in 64-bit PCI mode, chip features dual power supply and supports x4 PCI Express lanes and single PCI/PCI-X domain.

Original Press Release:

NEC Electronics America Expands PCI Express Single-Port ASSP Family with Very Small Form Factor Bridge

PCI Express to PCI/PCI-X Bridge Offers Ultra-Low Power and Thin Profile for Storage and Networking Applications

SAN JOSE, Calif., June 8 / -- PCI-SIG Developers Conference -- NEC Electronics America, Inc. today announced it has expanded its portfolio of PCI Express® semiconductor solutions to include a very low-power, single-port PCI Express-to-PCI®/PCI-X® bridge chip. With a small form factor of 17 square millimeters (mm), the low-power uPD720405 bridge device is ideal for networking and storage applications that have stringent space limitations, such as workstation and server motherboards and low-profile cards (LPCs).

"The demand for high-speed advanced interconnect technologies such as PCI Express continues to increase, and form factor is a key consideration. This is particularly true for designers working with enterprise, storage and networking applications that have very specific size limitations in addition to requirements for high speed and reliability," said Kugao Ouchi, general manager, digital consumer and connectivity strategic business unit, NEC Electronics America. "With the introduction of the uPD720405 bridge chip, NEC Electronics America is pleased to offer designers a very low-power PCI Express solution that has a small form factor, provides an easy migration path from native PCI/PCI-X devices and ensures compatibility of previous generations of PCI standards with the emerging PCI Express standard."

The uPD720405 application-specific standard product (ASSP) supports x4 PCI Express lanes and a single PCI/PCI-X domain, and operates at 133-megahertz (MHz) in single-data-rate PCI-X mode or 66 MHz in 64-bit PCI mode. The ASSP also supports standard PCI Express power management states, as well as optional advanced PCI Express power management states, such as Link (from L0, L0s, L1, L2/L3 Ready and L3) and Device (D0, D1, D2, and D3hot and D3cold). This support allows designers to minimize power consumption while complying with PCI specifications. Like the uPD720404 PCI Express bridge device announced earlier this year, the uPD720405 ASSP features a dual power supply that eliminates the need for special power-up sequencing. The new bridge device also supports advanced error reporting and has a very low power consumption level of 2 watts, which eliminates the need for heat sinks in most applications. NEC Electronics' uPD720405 ASSP is available in a 17 mm x 17 mm ball-grid array (BGA) package that enables the device to fit into LPCs with heights as low as 64.41 mm, compared to the 106.88 mm height in standard PCI form factors.

More information on NEC Electronics' PCI Express products can be found at

NEC Electronics' PCI Express ASSPs and IP Solutions

PCI Express is a third-generation, scalable input/output (I/O) architecture for use in desktop, mobile, server, communication platform, workstation and embedded devices. As PC and server CPUs and other I/O devices increase in speed, technologies such as PCI Express are needed to ensure that I/O interfaces do not create performance bottlenecks in systems. NEC Electronics' PCI Express ASSPs are compliant with revisions 1.0a and 1.1 of the PCI Express base specification. NEC Electronics' PCI Express IP solutions include transceiver and generic controller cores based on a data link and transaction layer architecture that enables data transfers to the switch fabric, physical logic layers based on NEC Electronics' serializer/deserializer (SerDes) technology, and link layer cores. NEC Electronics America was the first company to demonstrate a PCI Express PHY chip and endpoint controller core in 2002.

Pricing and Availability

Samples of NEC Electronics America's uPD720405 PCI Express bridge ASSP is expected to be available starting Q3 2006 with mass production to begin in Q1 2007. In addition, the uPD720404 bridge ASSP, announced in March 2006, is currently in mass production with sample pricing starting at $28.50. (Pricing and availability are subject to change.)

About NEC Electronics America, Inc.

NEC Electronics America, Inc., headquartered in Santa Clara, California, is a wholly owned subsidiary of NEC Electronics Corporation , a leading provider of semiconductor products encompassing advanced technology solutions for the broadband and communications markets; system solutions for the mobile, PC, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics America offers local manufacturing in Roseville, California, and the global manufacturing capabilities of its parent company. In the Americas, NEC Electronics America markets and sells industrial-type active-matrix LCD modules from NEC LCD Technologies, Ltd., a global leader in innovative display technologies. More information about the products offered by NEC Electronics America can be found at

NOTE: NEC Electronics America is either a registered trademark or trademark of NEC Electronics Corporation in the United States and/or other countries. PCI Express, PCI-X, PCI and PCI-SIG are trademarks or registered trademarks of PCI-SIG. All other registered trademarks or trademarks are property of their respective owners.

Source: NEC Electronics America, Inc.

Klaudeen Shemirani of NEC Electronics America, Inc., +1-408-588-5402, or;

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