Board-Level EMI Shield allows post-reflow detachment.

Press Release Summary:



ReMovl(TM) board-level shield incorporates ReCovr attachment mechanism applied to pickup bridge of BLS frame, allowing permanent, tool-less detachment of bridge after frame is soldered to PCB. Raised pickup bridge option allows for clearance above PCB components during placement and reflow. Suited for manufacturing processes where post reflow detachment of pickup bridge is beneficial/required, product has .080 in. height (min), .071 in. top flange width, and 0.5-1.0 lb typ pull force.



Original Press Release:



Laird Technologies Introduces Board-Level Shield ReMovl(TM) Enhancement



Feature Allows for Detachment of Pickup Bridge

St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new ReMovl(TM) board-level shielding product enhancement.

Building on the success of the proprietary and patented (US Patent 7504592, Korea Patent 10-0898026, Patents Pending: China, Europe, India, Japan and Taiwan) ReCovr(TM) shield design, ReMovl incorporates the ReCovr attachment mechanism applied to the pickup bridge of the BLS frame to allow for easy, tool-less detachment of the bridge after the frame is soldered to the printed circuit board.

"The Laird Technologies EMI shielding engineers continue to look for new and improved ways to bring advanced suppression technology to PCBs while making access to board components under the shield easier," said Allan Dukeshire, Laird Technologies EMI Metals Product Manager. "Our team works diligently to identify problems in the marketplace and then develop technologies that solve these problems for our customers."

The ReMovl feature is ideal for manufacturing processes where post reflow detachment of the pickup bridge is beneficial. There are several applications that often require the bridge to be detached including inspection, rework, Thermal Interface Material (TIM) assembly into cover, and noise or vibration concerns of bridge to cover.

As an industry-leading EMI solutions provider, Laird Technologies provides innovative board-level shielding solutions for high-tech industries and applications around the world. For more information, please logon to www.lairdtech.com.

Contact Information
For additional information, visit www.lairdtech.com or contact us at:
Americas: +1-866-928-8181 or EMI-AmericasSales@lairdtech.com
Europe: +49-(0)-8031-2460-0 or EMI-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x891 or EMI-AsiaSales@lairdtech.com

Translations
Translated versions of this press release are available in Simplified and Traditional Chinese, Japanese, Korean, and German languages.

About Laird Technologies, Inc.
Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 9,000 employees in more than 46 facilities located in 16 countries.

Trademarks
© 2012 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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Meltwater Press, 50 Fremont Street, Suite 200, San Francisco, CA 94105

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