Bluetooth RF Module links sensor data chain to Web.
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Press Release Summary:
Based on TI's CC2560 Bluetooth core IC, PAN1315 measures 6.5 x 9 x 1.7 mm and accommodates PCB pad pitch of 1.3 mm and as little as 2 layers. Design is 100% pin-compatible with next-gen Bluetooth low energy devices, and facilitates connectivity between mobile devices and small button cell battery-powered devices to create data chain from sensors to Web. Host Controlled Interface (HCI) supports several transport layers with UART rates to 4 Mbps as well as 3- and 4-Wire UART transport.
Original Press Release:
Panasonic's New PAN1315
Panasonic's new PAN1315 Host Controlled Interface (HCI) Bluetooth RF module brings Texas Instrument's seventh generation Bluetooth core integrated circuit, the CC2560, to an easy to use module format. Panasonic's tiny footprint technology has produced a module of only 58.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing.
This module has been designed to be 100% pin compatible with the next generation of Bluetooth Low Energy devices. This unique design feature enables designers to seamlessly transition between Bluetooth Classic and Low Energy modules.
The PAN1315 makes connectivity between mobile devices such as cellular phones and small button cell battery powered devices like fitness sensors, watches, healthcare, entertainment and mobile accessories easily implemented, creating a seamless data chain from sensors to the web.
PAN1315 Full Specification
Applications
Assisted Living
Industrial Sensors
Product Performance
Interfaces:
The PAN1315 Host Controlled Interface supports several transport layers with the following features:
