Bluetooth Module provides compact wireless communications.

Press Release Summary:

Compact LTCC RF module measures 7 x 7 x 1.8 mm, uses one-third less power than company's other modules, and provides Bluetooth 1.1-compliant Class 2 (max 4dB) output. It complies with Silicon Wave RF and Blue-RF interfaces, and GSM and CDMA de facto standards. Low temperature co-fired ceramic substrate includes filter, inductors and capacitor. Applications include wireless communications devices such as cell phones and PDA's.

Original Press Release:

Taiyo Yuden Develops World's Smallest Bluetooth(TM) RF Module Using Advanced Low Temperature Co-Fired Ceramics (LTCC) Substrate

New RF module's ultra-compact form factor measures only 7 x7 x 1.8mm; device is designated to use one-third less power than other Bluetooth modules

SCHAUMBURG, IL-December 10, 2001-Taiyo Yuden Co. Ltd, a forerunner in the field of Bluetooth module development and manufacturing, announced today at the Bluetooth Developers Conference (San Francisco, Dec 11-13) the world's smallest RF module for the next generation of Bluetooth-based wireless communications devices, including cell phones and PDAs. The ultra-compact RF module employs a unique LTCC (Low Temperature Co-fired Ceramics) substrate that is achieved by embedding the filter, inductors and capacitor into the substrate and using flip-chip assembly techniques to mount the semiconductor. Measuring only 7.0mm (0.276") L x 7.0mm (0.276") W x 1.8mm (0.071") H, the ultra-compact module incorporates a Silicon Wave RF chipset with superb high- frequency performance providing a Bluetooth 1.1-compliant Class 2 (max 4dBm) output. To meet more stringent portable device power requirements, the module was designed to use one-third less power than other Bluetooth modules.

Additional LTCC RF Module Highlights:
* This robust, highly flexible customer solution offers full compliance to the Silicon Wave RF interface, the Blue-RF interface (the GSM and CDMA de facto standard) and others.
* Designed to operate with various clock frequencies, the module allows true design flexibility by allowing the designer to use an existing application frequency, rather than change to suit the module.
* Production samples will be available in February 2002, with volume production beginning in June. (Taiyo Yuden forecasts production of its entire Bluetooth module line will achieve one million units per month in 2002.)

Price & Delivery: Consult Factory.

About Taiyo Yuden:
Taiyo Yuden, a rapidly emerging leader in Bluetooth module development and implementation, combines its expertise in multilayered component manufacturing, high-frequency circuitry design, advanced assembly techniques and evaluation technologies with aggressive Bluetooth research, development and strategic partnerships. Now in its fifty-first year, Tokyo-based Taiyo Yuden Co., Ltd. is a worldwide manufacturer of surface mount and leaded passive components, power electronics modules and power supplies. With approximately 50% of the worldwide market in high-frequency multilayer chip inductors used in cellular phone applications, Taiyo Yuden reports annual sales of nearly US51.6B. Worldwide, Taiyo Yuden employs more than eighteen thousand people. and the company's North American affiliate, Taiyo Yuden (U.S.A.), Inc., operates sales and engineering offices in Chicago, San Jose and San Diego County..

About Silicon Wave:
Founded in 1997 in San Diego, California, Silicon Wave is a high-frequency semiconductor development company excelling in component miniaturization and reduced power consumption through the use of SOI (Silicon On Insulator) Bi-CMOS processes. The company is currently in a joint partnership agreement with Taiyo Yuden. Technologv Background: Founded in May 1998 by Ericsson, Nokia, Intel, IBM and Toshiba, the Bluetooth Special Interest Group (SIG) is the official Bluetooth Specification standardization committee. 2100 companies participate in the organization today, with Microsoft, 3Com, Lucent and Motorola the current promoting members. Bluetooth Specification Version 1. I was released in May 2001 as an update to the 1.0 specification of July 1999. Bluetooth modules are classified by output: Class I (max 20dBm), Class 2 (max 4dBm) or Class 3 (0dBm). The higher the output, the more distance the device can cover. Flip-chip assembly mounts the chip directly on the PCB using terminations called "bumps." After mounting, insulation materials are inserted between the chip and board. The big advantage that flip-chip enjoys over conventional wire-bonding methods is that it requires significantly less mounting space.

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