BGA-to-BGA Adapter solves RoHS-related soldering problems.
Press Release Summary:
BGA-to-BGA adapter solves solder joint reliability problems that occur when RoHS-compliant solder balls are assembled with devices whose connections are not lead-free. Adapter body is made from high-temperature glass reinforced material that allows lead-free components to be mounted at higher temperatures, while eutectic tin-lead ball terminations, which have standard reflow temperatures profiles, enable assembly to be mounted to tin-lead PCB using standard temperatures.
Original Press Release:
New Lead-Free BGA to Tin-Lead BGA Adapter from Aries Electronics Solves RoHS-Related Soldering Problems
FRENCHTOWN, N.J., August 2006 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new ball grid array (BGA) to BGA adapter which resolves soldering issues that arise when BGA devices with RoHS-compliant solder balls are assembled with other devices whose connections are not lead-free.
Aries' new adapter solves solder joint reliability problems that occur when the lower reflow temperatures used for standard tin-lead eutectic solder balls cause the incomplete reflow of the lead-free solder balls. The lower temperatures may also be required to avoid damaging the PCB and other components on the board.
Because the body for the BGA-to-BGA adapter is made from RoHS-compliant, high-temperature (IPC 4101A 24/26/28) glass reinforced material, lead-free components can be mounted to the new adapter using the necessary higher temperatures. Then, since the adapter is terminated with eutectic tin-lead balls that have standard reflow temperatures profiles, the assembly is mounted to the tin-lead PCB using standard temperatures; thus resolving solder mismatch concerns. The adapter's finish is three to eight microinches of gold over nickel (ENIG) with a red solder mask.
As with all Aries adapters, the new adapter is available in custom materials, plating, sizes and configurations to suit specific customer applications.
Pricing for the BGA-to-BGA adapter ranges from $5 to $15 each, depending on the ball count and the quantity required. Lead time is three to four weeks.
For additional information, contact
Aries Electronics, Inc.,
P.O. Box 130,
Frenchtown, N.J. 08825.
Tel: 908/996-6841;
Fax: 908/996-3891;
Email: info@arieselec.com;
Web: www.arieselec.com.
Europe contact Tel: +44 870 240 0249;
Email: europe@arieselec.com.
READER SERVICE INQUIRIES: Please forward all reader service inquiries to
Frank Folmsbee,
Aries Electronics, Inc.,
P.O. Box 130,
Frenchtown, NJ 08825.
NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
