BGA Socket holds DDR3 LRDIMM memory buffer.

Press Release Summary:

Featuring typical contact resistance of 20 mW per I/O, SG-BGA-7181 is designed for 13.5 x 25.2 x 1.95 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It has pin self-inductance of 0.15 nH, mutual inductance of 0.025 nH, capacitance to ground of 0.01 pF, and current capacity of 2 A per pin. Targeting 0.65 mm pitch 588 pin BGA, device operates at -35 to +100°C and is built with low inductance gold plated embedded wire on elastomer.

Original Press Release:

GHz Bandwidth Socket for DDR3 LRDIMM Memory Buffer

BURNSVILLE, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 0.65mm pitch 588 pin BGA. The SG-BGA-7181 socket is designed for 13.5mm x 25.2mm x 1.95mm package size and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a new quick insertion method so that IC's can be changed out quickly. The application of the socket is to verify the function of IC in a development system specifically memory functions.

The SG-BGA-7181 sockets are constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and PCB. The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.

Pricing for the SG-BGA-7181 is $1204 at qty 1; with reduced pricing available depending on quantity required.

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