BGA Socket accommodates devices up to 6.5 mm².
Press Release Summary:
Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that provides proper force against device and allows for height variations in device thickness.
Original Press Release:
Aries Electronics' New CSP/MicroBGA Test and Burn-In Socket Now Accommodates Devices up to 6.5 mm Squared
Bristol, Pa - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has just released its new CSP/MicroBGA test and burn-in socket that accommodates devices of up to 6.5 mm squared and is ideal for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The socket offers solderless pressure mount compression spring probes, which can be accurately located by two molded plastic alignment pins and mounted with two stainless steel screws, which allow the sockets to be easily mounted to and removed from the burn-in-board (BIB). This operator friendly socket highlights an overall small profile, allowing a maximum number of sockets per BIB and BIBs per oven.
The socket also features a pressure pad compression spring that provides proper force against the device and allows for height variations in device thickness. In addition, the gold over nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls.
The socket accommodates up to 500,000 cycles and operates at a temperature of -55°C to 150°C (-67°F to 302°F). The sockets are comprised of spring probes with contact forces of 15 g per contact on 0.30 mm to 0.35 mm pitches, 16 g per contact on 0.40 mm to 0.45 mm pitches, 25 g per contact on 0.50 mm to 0.75 mm pitches and 25 g per contact on an 0.80 mm pitch or larger. Spring probes are heat-treated beryllium copper alloy plated with 30 µ min. (.75 µ) gold per Mil-G-45204 over 30 µ min. (.75 µm) nickel per SAE-AMS-QQ-N-290. The socket's molded components are UL94V-0 Ultem and machined components are UL94V-0 PEEK or Torlon. All hardware is stainless steel.
As with all Aries sockets, the new test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a 100 lead socket starts at $200.00. Delivery is 20 working days ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: www.arieselec.com, Data sheet # 23000-http://arieselec.com/products/23000.pdf. Europe Email: europe@arieselec.com.
Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
URL: www.arieselec.com
