Backside Wafer Coating is enabled by mass imaging platform.
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Press Release Summary:
High-throughput backside wafer coating process is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV) required by wafer processing specialists. Process, compatible with underfill or adhesive-type coatings normally applied to backside of semiconductor wafers prior to singulation, is also compatible with company's metal stencil and emulsion screen technologies.
Original Press Release:
High-Speed Backside Wafer Coating Enabled by DEK's High Accuracy Mass Imaging Technology
Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution. The company has successfully developed a high throughput backside wafer coating process, which is hosted on a mass imaging platform and capable of exceeding the +/- 12.5 um Total Thickness Variation (TTV) required by most wafer processing specialists. The company's new process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50 m thickness to the backside of semiconductor wafers prior to singulation.
"For any backside wafer coating process, TTV is the critical success factor," says Clive Ashmore, DEK's global applied process engineering group manager. "With this latest application advancement, we are helping semiconductor packaging manufacturers increase throughput and reduce the cost per package by using high accuracy mass imaging."
The equipment used in DEK's backside wafer coating process, which includes an optional wafer handler, DEK flexible printing platform and a reflow oven, is also inherently more flexible than dedicated backside coating machines. The DEK system can be easily re-deployed for other processing requirements and provides incredible flexibility while delivering an even higher return on investment.
DEK's backside wafer coating process is compatible with the company's metal stencil and emulsion screen technologies. Metal stencils enable materials with larger filler particles, such as encapsulation materials, to be applied with a totally smooth surface finish. Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed. In each case, the capabilities of the machine and stencil technology are key to achieving control over the print thickness and ensuring uniformity at high volumes.
"As experts in materials deposition, we are now intimately familiar with the impact of stencil technology, thread size, emulsion thickness, metal thickness, squeegee or ProFlow selection and machine parameter settings when implementing backside wafer coating," says Ashmore. "DEK has effectively taken our decades of applied materials expertise and created a cost-effective, fast and accurate solution for this critical packaging process."
For more information on DEK's Backside Wafer Coating processes or any of its innovative semiconductor packaging solutions, log onto www.dek.com.
About DEK
DEK is a global provider of advanced pre-placement manufacturing solutions and innovative deposition technologies for a wide range of electronic materials. For more information, visit DEK at www.dek.com.
Company Contact
Rich Heimsch
DEK International GmbH.
Geroldstrasse 28
4 Stock
Ch-8005 Zurich
Switzerland
Tel: +41 1 274 80 20
Fax: +41 1 274 80 22
E-mail: rheimsch@dek.com
Internet: www.dek.com
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Protean Marketing Communications Ltd
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Tel: +44 1628 648530
Fax: +44 1628 529087
Email: zoe.walter@protean.co.uk
Internet: www.protean.co.uk
