Backplane Module provides more than 12 Gb/s performance.
Press Release Summary:
Suited for customers looking to implement high-density backplane interconnect system, Z-PACK TinMan 6-Pair Module offers 80 differential pairs/inch, fitting within 1.15 in. card slot pitch. Unit features fully protected right-angle receptacle for use on daughtercards, and field repairability at module or single pin levels. Low crosstalk and high throughput are achieved by positioning ground contacts within each column.
Original Press Release:
Tyco Electronics' Z-PACK TinMan Products Expand with 6-Pair Module
Tyco Electronics' Z-PACK TinMan Products Expand with 6-Pair Module
June 2008-Tyco Electronics introduces the addition of the new 6-pair module to its Z-PACK TinMan backplane product portfolio. The new 6-pair module offers 80 differential pairs per inch, fitting within a 1.15" card slot pitch. This module is ideal for customers looking to implement an extremely high-density, cost-effective backplane interconnect system.
As with the entire Z-PACK TinMan product family, the 6-pair module provides 12+ Gb/s performance, a fully protected right-angle receptacle for use on daughtercards, and field repairability at the module or single pin levels. Additionally, low crosstalk and high throughput performance are achieved by positioning ground contacts within each column, along with unique contact lead frame placements. Samples are available upon request.
"Tyco Electronics continues to expand the breadth of the Z-PACK TinMan product line to support market and specific customer needs. The new 6-pair product will address the increased density and speed demands of our leading edge customers," said Bob Hnatuck, Tyco Electronics' product manager.
For more information, visit tycoelectronics.com/products/tinmanpr.
