Axcelis to Showcase Enabling Implant and Plasma Cleaning Solutions at SEMICON China 2012


Innovative Technology Portfolio Designed to Optimize Precision, Purity and Productivity for 2Xnm and Beyond

BEVERLY, Mass. - Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it will showcase its latest advancements in ion implantation and plasma dry strip technology at SEMICON China 2012. The show is being held March 20-22, at the Shanghai New International Exhibition Center (SNIEC) in Shanghai, China.

Please visit the Axcelis showcase at Booth #3501, in Hall 3, to learn more about our newest technology, designed to usher in a new era of precision, purity and productivity in IC manufacturing:

- Optima XEx(TM) high energy implanter is the world's #1 high energy
system, featuring the broadest energy range and highest beam currents
for unmatched productivity. Its unique endstation and LINAC beamline
ensures the industry's lowest metals levels, for superior image sensor
performance.

- Optima HDx(TM) high current implanter's enabling spot beam technology
combined with its proprietary wafer temperature control delivers higher
yields and profitability critical for today's challenging device
manufacturing environment. The system features the new Eterna ELS3
source, designed to extend source life by an unprecedented 500%
improvement for Carbon, and a 300% improvement for Germanium
applications for shallow junctions in sub 2Xnm nodes.

- Optima MDxt(TM) mid current implanter is an exciting new entrant to the
market, delivering unmatched levels of productivity and energy purity
across the broadest range of medium current implant applications. Its
precision angle control, patented energy filter and constant focal
length scanning minimizes device performance variation, providing the
highest yield possible.

- Integra ES(TM) plasma cleaning system is the only product on the market
capable of delivering enhanced device performance benefits with
production-proven, non-oxidizing processes, to maximize dopant retention
for sub-2Xnm logic devices. The system also features an innovative,
modular, cluster design for outstanding manufacturing flexibility and
speed for optimized return on your equipment investment.

The company is also participating in the China Semiconductor Technology International Conference (CSTIC), the largest semiconductor technology conference in China, held in conjunction with the show on March 18-19, at the Kerry Hotel in Shanghai, China. Axcelis technologists will be presenting several talks:

CSTIC 2012 Highlights

Sunday, March 18, 14:00-14:25PM

Symposium VI: Materials and Process Integration for Device Interconnection

A Comprehensive Study of Low Temperature and Molecular Carbon Implantation for sub-28nm Device Fabrication, by Steve Zhao, Mike Ameen and Leonard Rubin of Axcelis Technologies Monday, March 19, 15:50-16:05

Symposium III: Dry & Wet Etch and Clean

Study of Post Plasma Doping Photoresist Strip, by Shijian Luo of Axcelis Technologies

Axcelis Technologies, Inc. (Nasdaq: ACLS) headquartered in Beverly, Massachusetts, USA, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. For more information, visit: www.axcelis.com.

Company Contact:

Maureen Hart (editorial/media)
978.787.4266
maureen.hart@axcelis.com

SOURCE

Axcelis Technologies, Inc.

Web Site: www.axcelis.com

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