Automotive Image Sensor features LFM technology, ASIL B support.

Press Release Summary:

Offered in 11 x 10 mm iBGA-121 package for automotive Advanced Driver Assistance Systems (ADAS) applications, AR0231AT 2.3 MP CMOS image sensor can capture images in linear, high dynamic range (HDR), or LED Flicker Mitigation (LFM) modes and supports Automotive Safety Integrity Level B (ASIL B). Other features include frame-to-frame context switching between modes, 1/2.7 in. optical format, 1928 x 1208 active pixel array, and multi-camera synchronization support.

Original Press Release:

ON Semiconductor Announces Sampling of Next Generation Automotive Image Sensor with LED Flicker Mitigation and ASIL B Support

New High Dynamic Range BSI device for Advanced Driver Assistance Systems

PHOENIX, Ariz. – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, announced sampling of ground-breaking LED Flicker Mitigation (LFM) technology in a new 2.3 megapixel (MP) CMOS image sensor that sets a new benchmark for automotive Advanced Driver Assistance Systems (ADAS) applications. Capable of capturing 1080p high dynamic range (HDR) video, the AR0231AT also includes features that support Automotive Safety Integrity Level B (ASIL B).

The LFM technology (patent pending) eliminates high frequency LED flicker from traffic signs and vehicle LED lighting and allows Traffic Sign Reading algorithms to operate in all light conditions. The AR0231AT has a 1 / 2.7 in. (6.82 mm) optical format and a 1928 (horizontal) x 1208 (vertical) active pixel array. It uses the latest 3.0 micron Back Side Illuminated (BSI) pixel with ON Semiconductor’s DR-Pix™ technology, which offers dual conversion gain for improved performance under all lighting conditions. It captures images in linear, HDR or LFM modes, and offers frame-to-frame context switching between modes.

The new device offers up to 4-exposure HDR, capturing more than 120 dB dynamic range with superior noise performance. The AR0231AT is capable of multi-camera synchronization support to ease implementation in vehicle applications with multiple sensor nodes, and user programmability is achieved via a simple two-wire serial interface. It also has multiple data interfaces including MIPI, parallel and HiSPi. Other key features include selectable automatic or user controlled black level control, spread-spectrum input clock support and multiple color filter array options.

“ON Semiconductor is again demonstrating its market leadership by being the first to deliver samples of a sensor with LFM in the AR0231AT,” said Alvin Wong, senior director, Automotive Imaging and Scanning Division at ON Semiconductor. “Features that support LFM and ASIL B in a 2.3 MP, 1080p BSI image sensor, represent a state of the art combination ideal for high performance automotive ADAS cameras.”

Packaging and Availability

The AR0231AT is offered in an 11 mm x 10 mm iBGA-121 package and engineering samples are available now.  It has an operating temperature range of -40 to +105 degrees C (ambient) and will be fully AEC-Q100 qualified.  It will be available in mass production in 2016.

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About ON Semiconductor

ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit

ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.


Veronika Holscher

Media Relations

ON Semiconductor

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Parag Agarwal

Vice President Investor Relations

ON Semiconductor

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