Automatic Wire Bonder facilitates setup and changeover.

Press Release Summary:

As fine-pitch, fine-wire (17-75 micron), automatic gold ball bonder, Q2119A meets production demands associated with smaller lot sizes, multiple product variations, and frequent set-up changes. Package conversions can be completed in minutes while accommodating various device configurations, and features such as pattern recognition system, ball bumping and coining capability, and programmable security bonds support needs from prototyping to medium volume production.

Original Press Release:

Questar Gold Ball Bonder Simplifies Set-up, Changeover

Fully automatic, fine-pitch machines offer enhanced accuracy and affordability...

PLEASANTON, Calif. - Questar Products International, a manufacturer of automatic wire bonders for the global assembly market, has developed a fine-pitch, fine-wire (17µ-75µ), automatic gold ball bonder designed specifically to meet today's production challenges associated with smaller lot sizes, multiple product variations and frequent set-up changes. Designated the Q2119A, this gold ball auto bonder supports a variety of customer needs from prototyping to medium volume production. Package conversions can be completed in minutes while accommodating a multitude of device configurations.

"The Q2100 Automatic Wire Bonder Series fills a price/performance void in solid state component assembly as no other wire bonder line offers a comparable combination of operator friendliness, flexibility, productivity, quality and low cost-of-ownership. Other manufacturers simply cannot match the Q2119A's productivity at our cost-effective price point," said Dennis Scott, president, Questar Products International.

The Q2119A is designed with today's demanding applications in mind. In addition to fine-pitch capability, the machine's superior performance levels are due, in part, to its fast, accurate pattern recognition system, ball bumping and coining capability, and programmable security bonds.

Users will save on maintenance costs due to virtually maintenance-free electronics. When service is needed, however, it can be accomplished quickly and efficiently with available remote diagnostics for the software and unrestricted access to the component bay. Procurement of replacement parts is simplified and less expensive, as the machines are designed with off-the-shelf components available from suppliers worldwide.

Running on the Windows XP Pro(TM) operating system, the Q2119A offers intuitive, menu-driven software that is easy to program, with convenient access to all machine functions. The user-friendly operator interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage; and a bond parameter library. Options for further flexibility include programmable ultrasonic generator (256 increments) with low impedance transducers, programmable temperature controllers (optional dual-loop), unique, application specific software, and custom machines with large table up to 300mm x 300mm.

For more information on the Q2119A, visit or to view the product video, visit

About Questar
Since 1984, Questar has been providing wire-bonding machines to the global solid-state component assembly market. Today, Questar fine-pitch automatic wire bonders are cost-effective, flexible, easy-to-use, and delivered at a price-point that is unmatched by any other manufacturer. While other manufacturers focus on equipment with high-speed, high-volume capabilities, Questar is committed to supplying machines and support to customers with lower volume, smaller lots, high wire count and other special needs. For more information, please visit or call 925-461-0100.

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