Automated Pick/Place Unit offers vision-based centering.
Press Release Summary:
Complementing SMT placement applications with its operational speeds to 3,000 cph, benchtop LE40V employs Windows®-based GUI that enables board programming within minutes. It places range of components, including 0201s, LEDs, BGAs, 15 mil pitch QFPs, SMT connectors, and offers on-the-fly component centering using vision (Cognex®), laser technology (Cyberoptics®), or mechanical fingers. Self-contained system accepts boards to 13.5 x 22 in. and offers placement accuracy of ±0.001 in.
Original Press Release:
New LE40V Benchtop Automated Pick & Place with Vision Centering
LE-40V Pick and Place Equipment with Vision
Benchtop pick and place model with Vision equipment offers technologically advanced, low cost solutions for low to medium volume SMT placement applications. The LE40V is specifically designed for facilities where quick setup, ease of operation and high reliability are paramount.
Max board size: 13.5" x 22" (343mm x 560mm)
Smallest component capability: 0201 components
Largest component size: 1.96" (50mm) square body
Placement accuracy: ± 0.001" (0.025mm)
Max placement rate: 3000 cph
Typical verifiable placement rate: 1800 - 2500 cph
Fine pitch capability: To 15 mil pitch (0.381mm)
Max travel area: 22" (X axis) x 22" (Y axis) (560mm x 560mm)
Overall dimensions: 40" x 42" x 27" (1016mm x 1067mm x 686mm)
Max no. of feeders (8mm tape): 64
Max no. of feeders with L-GB-12 bank feeders: 96
Tape feeders: 8, 12, 16, 24, 32, 44 mm (Electrical)
Vibratory Feeders: Loose, tube, stick (frequency & amplitude control)
Matrix Tray Feeders: With Board/Matrix tray holders
Laser Centering: Touchless Cyberoptics® laser
Vision system: Cognex® Vision
Dispenser Option: Up to 10,000 dots/hour
