ATR Enclosures target avionics applications.

Press Release Summary:

Available in both fan convection and conduction-cooled versions, ATR Series includes ½ and ¾ sizes in long and short ARINC formats. Backplanes are available off-the-shelf or customized in CompactPCI, MicroTCA, OpenVPX, and VME/64x architectures. Depending on needs of application, ½ ATR short enclosure features dip-brazed or screwed and glued options.

Original Press Release:

New ATR Enclosure Solutions Offered by Pixus Technologies

Waterloo, Ontario — Pixus Technologies, a supplier of backplane, chassis, and embedded component solutions, now offers ATR (Austin Turnbull Radio) enclosure solutions for avionics and other applications. The first in the series is a conduction-cooled 1/2 ATR short, developed utilizing the frame from partner Wakefield-Vette.

The Pixus ATR Series offers various sizes and configurations of enclosures, in both fan convection and conduction-cooled versions. This includes sizes in 1/2 and 3/4 in the long and short ARINC formats. Backplanes are available off-the-shelf or customized in CompactPCI, MicroTCA, OpenVPX, VME/64x, and other architectures. Pixus has a highly experienced team in packaging the power, cooling, enclosure, backplane, I/O, and other components for a complete ATR solution. The company also utilizes the standard enclosure frame options of industry partners to offer customers a tailored design to their application.

The 1/2 ATR short enclosure features dip-brazed or "screwed and glued” options depending on the needs of the application. With a special milling process and tooling, the frames are typically significantly more cost-effective in manufacturability, while exceeding quality expectations.

Pixus Technologies stems from the former Kaparel team and leverages proven backplane and enclosure solutions that have been deployed for the last 20 years. The company has a vast selection of unique backplane configurations with or without integrated power connectors, that are well-suited for ATR applications.

For more information on Pixus Technologies’ rugged solutions, contact the company at or visit

About Pixus Technologies

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, PCIe and custom designs. Pixus also has an extensive library of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the exclusive North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

Pixus Technologies is actively involved in the continuous development of leading AdvancedTCA, OpenVPX, and cPCI/PCIe products that will surpass all data transfer and cooling challenges.

Justin Moll

VP, US Market Development

Pixus Technologies


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