Aries Electronics Announces New Test and Burn-In Sockets That Accept Devices with Pitches as Low as 0.40mm


FRENCHTOWN, N.J., January 2007 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced that all sizes of its CSP/Micro BGA test and burn-in sockets can now be used with devices requiring pitches as low as 0.40mm and higher. These sockets can also be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices.

The sockets are offered in four sizes: for device packages up to 13mm2, from 14mm2 to 27 mm2, up to 40mm2, and up to 55 mm2. They provide minimal signal loss for higher bandwidth capability via a signal path of only .077" (1.95mm), and their solderless, pressure-mount compression spring probes allow them to be easily mounted to, and removed from, the test board.

Each socket's small overall profile allows the maximum number of sockets per board, and boards per oven, while at the same time being operator friendly. The 4-point spring probe crown on these sockets ensures "scrub" on solder ball oxides for reliable contact mating, and their gold-over-nickel plated compression spring probe screws leave very small witness marks on the bottom of the device solder balls.

In addition, Aries' test and burn-in sockets feature compression spring probes that are heat-treated beryllium copper alloy, plated with 30 µ" min. (0.75µm) gold per Mil-G-45204 over 30 µ" min. (0.75µm) nickel per SAE-AMS-QQ-N-290. Their molded components are UL94V-0 PEEK and/or Ultem, and all hardware is stainless steel. Contact forces of the sockets are 16g per contact for 0.40mm pitch and 25g per contact for 0.50mm pitches and larger. Operating temperature is -55°C to +150°C (-67°F to +302°F) and estimated contact life is over 500,000 cycles.

Pricing for these sockets start at $95.00 each for 25 pieces of a 50 lead socket. Delivery is four to six weeks ARO.

For additional information, contact
Aries Electronics, Inc.,
P.O. Box 130,
Frenchtown, NJ 08825.
Tel: 908/996-6841;
Fax: 908/996-3891;
E-mail: info@arieselec.com;
Web: www.arieselec.com.

Europe contact
Tel: +44 870 240 0249;
Email: europe@arieselec.com.

READER SERVICE INQUIRIES: Please forward all reader service inquiries to
Frank Folmsbee,
Aries Electronics, Inc.,
P.O. Box 130,
Frenchtown, NJ 08825.

NOTE: Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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