AIM to Highlight NC259 No-Clean Solder Paste at NEPCON China 2012

AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its NC259 no-clean solder paste chemistry in Booth #1A02 at the upcoming NEPCON China 2012. The event is scheduled to take place April 25-27, 2012 at the Shanghai World Expo Exhibition & Convention Center.

NC259 solder paste has been developed in response to many issues that manufacturers face daily. It is the first low-cost, lead-free, halogen-free solder paste to offer the performance of tin-lead and high-silver lead-free solder pastes. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes. The ability of NC259 to eliminate head-in-pillow failures is critical as the use of leadless devices such as BGAs and QFNs increase.

Additionally, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.

For more information, meet company representatives in Booth #1A02 at the show or visit

About AIM

Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at, or e-mail



Kelly Cardone, Marketing Coordinator

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