AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013


CRANSTON, RI - April 8, 2013 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.



This low-cost, lead-free and halogen-free solder paste offers the performance of tin/lead and high-silver, lead-free solder pastes. Now manufacturers can attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes. NC259 provides excellent print definition and sustainable solder volume transfer as the demand for smaller pads increases. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs for the manufacturer.



NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in less solder waste, fewer restart costs and improved overall quality of prints. The long stencil life and shelf life results in far less waste than traditional solder pastes. The extremely broad process window of NC259 allows assemblers with high-density, high-mix boards to run without timely set up. NC259 also offers extremely low post-process residues, which remain crystal clear after soldering.



Additionally, AIM will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.



To discover all of AIM’s products, including lead-free and halogen-free solder, visit the company in booth #1A26 at NEPCON China or visit www.aimsolder.com.



About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.



For more information about AIM, visit http://www.aimsolder.com.

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