Adapters provide smaller pitch pads for larger pitch boards.
Press Release Summary:
Facilitating high density interconnect (HDI) construction, BGA Switch-A-Pitch Adapters allow tighter pitch devices to be placed on existing larger pitch designs. Series includes models with tops where BGA landing pads are on 0.40 mm pitch and adapter bottoms are populated with BGA balls on 1.27 mm pitch. Measuring 0.062 in. thick, design eliminates need for laser-drilled microvias on motherboards; standard line and trace spacing down to 0.003 in. can be used.
Original Press Release:
New Switch-A-Pitch Adapters from Aries Provide Even Smaller Pitch Landing Pads for Use on Larger Pitch Boards
Bristol, Pa. July 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded its line of BGA Switch-A-Pitch Adapters that simplify high density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards.
The series now includes models with tops where the BGA landing pads are on a 0.40 mm pitch and adapter bottoms are populated with BGA balls on a 1.27 mm pitch.
The new adapters significantly reduce costs. Designers can use readily-available, and therefore less expensive, larger pitch boards because the adapters allow new, tighter pitch devices to be placed on existing larger pitch designs. In addition, manufacturers can add components to designs at much lower costs, since the adapter tops leave open space around the location for the replacement device.
The Switch-A-Pitch design eliminates the need for laser-drilled microvias on motherboards. Standard line and trace spacing down to 0.003" (0.75 mm) can be used.
The adapters are 0.062" (1.57 mm) thick FR4 or Rogers 370 HR with 1/2 oz copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. The devices can operate up to 221°F (105°C) for FR4 or up to 266°F (130°C) for lead-free. Suggested PCB pad size is 0.022" (0.55 mm) for a 1.27 mm pitch.
Switch-A-Pitch Adapters are part of Aries' exclusive Correct-a-Chip adapter series that saves end users time and money by reducing board design time. Correct-A-Chip adapters can incorporate both passive and active components and can enable the use of one termination style or pitch on a board designed for a different style or pitch.
The adapters are available in various forms, including panelized, adapter only or as a turnkey solution with mounted devices. Specializing in custom design and production, Aries offers standard products as well as special materials, platings, sizes and configurations upon request.
Switch-A-Pitch adapters are custom made to customer requirements. A typical adapter with 64 positions is priced at $25 each for a quantity of 300 adapters.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: www.arieselec.com, Data sheet #18106: arieselec.com/Web_Data_Sheets/18106/18106.htm; Europe Email: europe@arieselec.com.
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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.
UPCOMING TRADESHOW: SEMICON West; Booth # 7751 West Level 1; July 14-16, 2009; San Francisco, CA
Headquartered in Bristol, Pa., Aries Electronics Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
