Acoustic Micro Imaging System inspects IGBT modules.

Press Release Summary:




Featuring fully automated design, C-SAM® Model DF2400Z images and analyzes voids and other structural defects of power IGBT modules. Inverted transducer, placed beneath module, prevents water from reaching module circuitry. Once recipe for scanning has been defined, factory automation interface controls operation with no need for human attention. Because imaging is typically carried out before encapsulation, acoustic images reveal what type of rework is needed on rejects.



Original Press Release:



Sonoscan Automates Inspection of IGBT Modules



Elk Grove Village, IL – Power IGBT modules having voids and other internal structural defects are a problem for makers and users of the modules. These defects can block heat dissipation and cause electrical failure.



Sonoscan has now developed and is shipping a fully automated Acoustic Micro Imaging system that images and analyzes these module defects.



The C-SAM® model DF2400Z incorporates Sonoscan’s inverted transducer, placed beneath the module to prevent water from reaching module circuitry. There is no need for human attention. Once your recipe for scanning has been defined, the factory automation interface controls the operation step by step:



• a conveyor loads two IGBT modules onto the two (for high throughput) system stages.



• the two ultrasonic transducers, one for each stage, raster-scan each module. Ultrasound is pulsed into the module and echo signals are received from gap-type defects at the depths of interest.



• at the conclusion of scanning, accepts and rejects are stacked in separate locations.



The accept/reject criteria are written by the user of the system. Early users of the system are chiefly searching for voids, delaminations and non-bonds in the solder layer, because these defects are frequent causes of failure. But all depths within the module can be imaged separately in a single scan, if desired, with no change in throughput speed.



Because imaging is typically carried out before encapsulation of the modules, the acoustic images reveal what type of rework is needed on rejects. In addition to finding gap-type defects at any level, the system can also image tilting and warping of module elements such as rafts.



Sonoscan, Inc., 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847-437-6400. Contact Bill Zuckerman x 237. Email bzuckerman@sonoscan.com;  web www.sonoscan.com.

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