New Thermal Interface Pad from Fujipoly Offers a Thermal Conductivity of 17.0 W/m.
Press Release Summary:
Sarcon® 30XR-m Thermal Interface Pad is available in 200 mm × 150 mm size sheets with 0.3 mm thick TIM or can be die-cut to fit application shape. Exhibiting a thermal resistance of 0.30° C•in²/W, unit is used as an interface material between heat source and nearby heat sink.
Original Press Release:
17-Watt Thermal Interface Pad
Carteret, NJ —Saturday, May 26, 2018—Sarcon® 30XR-m from Fujipoly® is a high-performance thermal interface material that exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape.
When placed between a heat source such as a semiconductor and a nearby heat sink, Sarcon® 30XR-m provides a thermal conductivity of 17.0 W/m•K and a thermal resistance of only 0.30° C•in²/W.
The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This increases surface contact with the heatsink, thereby improving overall cooling performance.
Fujipoly® Contact:
Frank Hobler
Fujipoly® America Corporation
732-969-0100
