DDR3L Memory Modules offer low profile, thermal dissipation.
Press Release Summary:
Featuring 17.78 mm profile, DDR3L Blade VLP (Very Low Profile) memory modules offer alternative to JEDEC standard VLP for space-constrained limitations in telecom and networking applications. Modules promote air flow in system and also utilize low-power DRAM to reduce thermal dissipation on DRAM surface. These products are available in 4 and 8 GB densities in range of ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations.
Original Press Release:
Virtium Expands Its Low Power, Low Thermal Dissipation DDR3L Memory Module Line with a New Reduced Height VLP Form Factor
The Virtium Blade VLP offers a lower-profile 17.78mm memory module solution that meets the space-constrained limitations in many telecom applications
Rancho Santa Margarita, California - Virtium Technology Inc., a leading provider of storage and memory solutions for embedded systems, today announced that it has expanded its line of low power, low thermal dissipation DDR3L memory modules with a new reduced height VLP (Very Low Profile) form factor. In addressing the needs of its customers, Virtium designed its Blade VLP as a lower-profile (17.78mm) alternative to the JEDEC standard VLP that has a height of 18.75mm. By reducing the height, Virtium's DDR3L Blade VLP memory modules offer a cost-effective solution that solves the space-constrained limitations found in many telecom and networking applications where it is difficult to accommodate the memory required for both an industry-standard DIMM or Mini DIMM socket plus a standard VLP at the 18.75mm height.
Virtium's DDR3L Blade VLP memory modules not only solve system space constraints allowing more air flow in the system, but also utilize low power DRAM to reduce the thermal dissipation up to 10°C on the DRAM surface, thus enabling a considerable increase in system performance. This is a particular design advantage as JEDEC specifies that systems running memory beyond 85°C must double the memory self-refresh rate. Virtium's low power DDR3L memory modules are designed to reduce the total power in systems that use multiple memory modules and those that must run above 85°C, which is a typical design challenge in a wide range of AdvancedTCA-based telecom and Ethernet blade switch networking applications.
"A variety of telecom and networking blade systems have serious limitations on system height. These systems also require spacing on top of memory module to enable airflow for improved thermal management. Virtium's Blade VLP DDR3L memory modules provide the low profile necessary to improve system airflow, which results in higher reliability to reduce the total cost of ownership (TCO)," said Phan Hoang, vice president of research and development at Virtium Technology. "And, Virtium's DDR3L Blade VLP modules now give OEMs an optimal memory solution that not only meets their space and thermal requirements, but also offers the single refresh rate that has become critical to maximize performance in high temperature systems."
Virtium DDR3L Blade VLP memory modules are available now in 4GB and 8GB densities in a wide range of ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations.
ABOUT VIRTIUM
Virtium Technology is a solutions-driven provider of memory and storage products for OEMs in the networking, industrial, medical and military markets. Virtium combines first-to-market solutions with continuity of support for legacy products that meet the performance, workload and product deployment requirements of its customers.
Virtium is known as a memory and storage technology innovator. The company is a driving force in the continuous development of memory module and SSD advancements that deliver density, form factor, extended temperature, ruggedization and configuration improvements.
For more information on Virtium and its products, please visit www.virtium.com.
