70-3812NC Epoxy Adhesive meets ASTM E-595-07 standards.
Press Release Summary:
Providing enhanced bonding and thermal conductivity, 70-3812NC Aluminum Filled Epoxy Adhesive is suitable for bonded fin heat sink and pipe bonding in extruded aluminum base applications. Formulated to be cured at room temperature or with mild heat, product’s 10:1 mix ratio is easy for batch mixing or using Meter Mix and Dispense Equipment.
Original Press Release:
Epoxy Adhesive Designed for Heat Sink Bonding
Electronic devices have become part of every-day use. Their design complexities, miniaturization, power consumption, and thermal management issues challenge OEM engineers. The 70-3812NC Aluminum Filled Epoxy Adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds.
In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’S outgassing requirements per ASTM E-595-07. The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications.
The 70-3812NC is a two component epoxy system formulated to be cured at room temperature or with mild heat. The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.
Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years. Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com.
More information about the 70-3812NC Aluminum Filled Epoxy is available at http://www.epoxies.com/_resources/common/bulletins/70-3812NC.pdf
Samples are readily available and ship within three days.
Contact:
Al DeSisto
Epoxies,
21 Starline Way
Cranston, RI 02921
Phone: (401) 946-5564 x103
Fax: (401) 946-5526
Michael Harrington
(401) 946-5564
