2015 Manufacturing Capabilities at Standard Printed Circuits
DESCRIPTIONÂ Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â PRODUCTIONÂ Â Â Â Â Â Â Â Â Â Â Â PROTOTYPEÂ Â Â Â Â Â Â Â Â Â Â EXPERIMENTAL
Minimum Laminate Thickness                .003"                            .002"                          .0005" (Cuflon)
Maximum Laminate Thickness               .250"                            .250"                          .260"
Maximum Layer Count                           24                                 26                               28
ONE OUNCE COPPER
Minimum Conductor Width                     .005"                            .004"                          .003"
Minimum Spacing                                   .005"                            .005"                         .004"
Minimum Annular Ring (PTH)Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .005"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .005"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .004"
HALF OUNCE COPPER
Minimum Conductor Width                     .003"                            .003"                          .002"
Minimum Spacing                                   .003"                            .003"                         .002"
Minimum Annular Ring (PTH)Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .004"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .003"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .003"
ETCHING
Line Width Tolerance                              +/- .001"                      +/- .0005"                  +/- .0004"
Front to Back Registration Tolerance     +/- .002"                       +/- .001"                    +/- .0007"
Max Copper Weight (with S/Mask)Â Â Â Â Â Â Â Â Â 3 ounce
Max Copper Weight (w/o S/Mask)          5 ounce                       7 ounce
Etch Factor (per ounce of base copper)Â 0.0006"
Minimum SMT pitch                                .020"                           .015"                          .012"
Minimum Annular Ring (signal layer)Â Â Â Â Â Â Â .008"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .008"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .006"
Minimum Clearance Ring (pwr/grd)Â Â Â Â Â Â Â Â Â .020"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .015"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .014"
FABRICATION
Minimum Edge Clearance (routing)Â Â Â Â Â Â Â Â .015"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .010"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .008"
Minimum Edge Clearance (scoring)Â Â Â Â Â Â Â .030"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .025"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .020"
Routed / Scored Panels we typically add:Â .500" waste area to all edges
Dimensional Accuracy (routing)Â Â Â Â Â Â Â Â Â Â Â Â Â Â +/- .005"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â +/- .003"
Dimensional Accuracy (scoring)Â Â Â Â Â Â Â Â Â Â Â Â Â +/- .020"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â +/- .020"
Minimum Score Thickness                      +/- .015"                      +/- .010"
Minimum Size for Routed Slot                .020"                           .020"
DRILLING
Minimum Hole Size (PTH)Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .008"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .007"Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â .006"
Drilled Hole Location Tolerance             +/- .003"                    +/- .002"                      +/-.001"
Max Aspect Ratio (Dt : hole dia)Â Â Â Â Â Â Â Â Â Â Â Â 8:1Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â 10:1Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â 12:1
Blind / Buried / Filled Vias yes
SOLDERMASK / SILKSCREEN
Min Soldermask Annular Ring       .003"
Min LPI Feature                            .004"
Min Line Width (silkscreen)Â Â Â Â Â Â Â Â Â Â .005"
Min Character Height (silkscreen)Â .050"
STANDARD PLATING THICKNESSES
Copper in PTHÂ Â Â Â Â Â Â Â Â Â Â Â .001 - .0015"
Tin Lead (solder)Â Â Â Â Â Â Â Â Â 300 – 500 micro inches
Electrolytic Nickel        150 – 200 micro inches
Electrolytic Gold          30-50 micro inches
Electrolytic Tin             150 – 200 micro inches
Electroless Tin             15-30 micro inches
Immersion Silver          10-15 micro inches
Electroless Nickel         118-236 micro inches (per IPC-4552 ENIG spec)
Immersion Gold            1.97 (min) micro inches (per IPC-4552 ENIG spec)
ENEPIG (for gold wire
bonding)Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â Â 125-200 micro inches Nickel; 3-8 micro inches Palladium; 1-3 micro
inches of Gold
BLIND AND BURIED VIAS – VIA FILL TECHNOLOGY (non-conductive and conductive)
HIGH SPEED DIGITAL DESIGNS
ELECTRICAL TESTING
Seica Flying Probe S20 BBT
4 Independent Probes – 2 sided
Continuity Test – 1 ohm to 10k ohm
Isolation Test – 10k ohm to 1g ohm
Voltage measurement - 5 to 250 Volts
Capacitance measurement – 0.1 pF to 100 mF
Min testable pad size - .010"
Min pitch - .010"
FULL MICRO-SECTIONING CAPABILITY
CONTROLLED IMPEDANCE (TDR) VERIFICATION
SOLDERABILITY and THERMAL STRESS TESTING
COORDINATE MEASUREMENT SYSTEM (2 systems)
Accurate to +/- .0001"
MATERIALS / LAMINATES
FR4, Multifunctional FR4, Polyimide, PTFE, Ceramic filled PTFE, TMM, and Thermally Conductive (TC). All Advanced Dielectrics including Arlon, Isola, Nelco, Rogers, PolyFlon, Taconic, and Ventec Laminates.
CERTIFICATIONS / REGISTRATIONS / QUALIFICATIONS
AS9100C / ISO9001 Certified
ITAR Registered
UL94 V-0 Underwriter’s Laboratories Flammability Rating on select materials
UL94 V-1 Underwriter’s Laboratories Flammability Rating on Polyimide
IPC-6012B Class 3 Capability – Qualification and Performance Specification of Rigid Printed Boards
IPC-6018 Class 3 Capability – Microwave End Product Board Inspection and Test
CAGE CODE 52LZ3 - SAM (System for Award Management) for Federal Contracting
INDUSTRIES
Aerospace, Military, Medical, Instrumentation and Sensors, Telecommunications, Industrial Controls, IT, Automotive, LED, Thermal Management.
