YINCAE President, Dr. Wusheng Yin, to Speak at IPC APEX EXPO 2015
(Albany, NY)Â Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be speaking at the upcoming IPC APEX EXPO. The IPC APEX EXPO will take place from February 22nd to February 26th. It will be held at the San Diego Convention Center in San Diego, California.
Dr. Yin will be presenting his white paper, “A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications.” This paper will focus on the electronic industry and the high interest in low temperature soldering processes. The paper discusses how YINCAE developed several products to meet these new industry demands – something that has been long desired but has seemed unobtainable until now. Dr. Yin will also be talking about the groundbreaking products that YINCAE has developed and are currently available.
YINCAE Advanced Materials, LLC hopes that you will come join us at the IPC APEX EXPO to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. There is a lot that can be taken away from not only Dr. Yin’s presentation, but IPC APEX EXPO as a whole. YINCAE hopes to see you there at the IPC APEX EXPO. Please visit us at booth 608!
Dr. Yin is a pioneer in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully utilized by major microelectronics product and contract manufacturers. His encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by 5 times while reducing thermal cycling failures by 10 times, with a reduction in solder voids of up to 79%. This data translates to significant production savings for microelectronics manufacturers.
IPC APEX EXPO 2015 is a five-day event like no other in the printed circuit board and electronics manufacturing industry. Professionals from around the world come together to participate in the Technical Conference, Exhibition, and Professional Development, Standards Development and Certification programs. These activities offer seemingly endless education and networking opportunities that impact your career and company by providing you the knowledge, technical skills and best practices to address any challenge you face.
If you wish to read the white paper “A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications” please click the following link: White Paper
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.
www.yincae.com
FOR ADDITIONAL INFORMATION CONTACT:
Taylor Farrell
Phone: (518) 452-2880
E-mail: tfarrell@yincae.com
