YINCAE Advanced Materials Successfully Exhibited at the 47th International Symposium on Microelectronics

(Albany, NY) – YINCAE Advanced Materials, LLC wishes to thank all of those who attended Dr. Yin’s presentation and those who visited our booth during the 47th International Symposium on Microelectronics. YINCAE Advanced Materials staff was pleased with the excellent attendance during the presentation by YINCAE President, Dr. Wusheng Yin. His presentation was titled “Solderable Anisotropic Conductive Adhesives for 3D Package Applications”. This advanced material presentation was given during the technical sessions at the IMAPS 2014 International Microelectronics Symposium. The technical sessions were held Oct 13th - 16th at the Towne Country Conference Center in San Diego, California.

The annual event also included a two day Exhibition from Oct 14th – 15th, allowing YINCAE Staff to showcase an advanced Solder Joint Encapsulant Series SMT 256/266. Technical and sales staff were available with Dr. Yin, during the exhibition, to address questions on this Solder Joint Encapsulant Series and many other innovative electronic assembly materials. Applications for the range of YINCAE Advanced Materials include; wafer coating and wafer bonding, die attach, underfilling and product conformal coating.

YINCAE is a corporate member and sponsor of the global IMAPS organization, (International Microelectronics Assembly and Packaging Society) with plans already in place to exhibit and present at the IMAPS 2015 conference. We look forward to seeing all of you at IMAPS 2015 in Orlando, Florida!

If you wish to read the white paper “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS”, please click the following link: White Paper

Visit the web link at yincae.com for information on the Advanced Materials or email Taylor Farrell: tfarrell@yincae.com, Phn # (518) 452-2880 at HQ in Albany, NY


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