Universal's APL Attends Regional and National Technology Events


Universal Instruments' Advanced Process Laboratory (APL) highlighted its Failure
Analysis and Prototyping capabilities at recent regional SMTA shows, including the LI
Chapter on October 13 and the Empire Chapter on October 19. Universal representatives
were on hand to discuss the lab's advanced capabilities as well as offering specific
presentations on Failure Analysis, 01005 Assembly, and Circuit Board Pad Cratering.
The APL will also be displaying at IMAPS 2010 - the 43rd International Symposium on
Microelectronics - on November 2-4.

The regional shows provided an opportunity to discuss market-specific challenges with local
OEMs, vendors, and manufacturers. George Westby, Director of Universal's Advanced Process
Lab, commented, "We're excited to discuss the unique concerns of this local electronics
community and contribute valuable knowledge to help them achieve the best possible results in
all of their processes." Westby continued, "Whether they want to refine the products they build
today, seamlessly develop and integrate a new product, or prepare for future products and
processes, we deliver competitive advantage."

The Long Island and Empire Chapter SMTA regional shows featured presentations including:
"Topic Expert Failure Analysis: Methods and Solutions" and "01005 Assembly Process,
Materials and Tooling". Universal's APL maintains a commitment to the SMTA with one
current lab members currently acting as the VP of the SMTA Empire Chapter and another on
the Board of Directors for the SMTA organization. The APL also maintains a high level of
involvement with local non-profits organizations and an industry leader.

The national IMAPS 2010 show will allow the APL to interact with manufacturers in the
Semiconductor market, where the group has had a lasting influence over the years through its
Process Support and AREA Research Consortium. Topics of research and development within
these forums have included; System-in-Package (SiP), wafer fabrication, bump design, intermetallic
studies, component manufacturing, over-molding, encapsulation, wafer bumping, and a
wide range of other subjects. Universal has applied this knowledge and expertise in the
development of its Genesis SC semiconductor placement platform, delivering high-accuracy
semiconductor performance at surface mount speeds.

About Universal Instruments:

Universal Instruments is a global leader in the design and manufacture of advanced automation
and assembly equipment solutions for the electronics manufacturing industry. Universal
provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around
the world, leveraging its portfolio of compatible and flexible equipment platforms that address
the diverse requirements of high-speed chip and multifunction placement applications as well
as component insertion. Universal Instruments is headquartered in Binghamton, with offices in
Europe, Asia, and the Americas.

Universal contact
Jeffrey Zopff
Universal Instruments Corporation
33 Broome Corporate Parkway
Conklin, NY 13748
USA
Tel: +1 607 779 5364
Email: zopff@uic.com
www.uic.com

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