Underfill Material enables recovery of substrates and PCBs.

Press Release Summary:

Manufactured in lead-free environments, Loctite® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing flexibility as it is compatible with lead-free solder materials.

Original Press Release:

New Loctite CSP Underfill System from Henkel Enhances Reliability of Hand-Held Devices; Lands Vision Award

Following several ground-breaking materials introductions, Henkel announces yet another materials advancement with the development and commercial availability of Loctite® 3536, an advanced underfill material designed to enhance the reliability of modern hand-held devices - especially those manufactured in lead-free environments.

Formulated specifically for use with today's fine-pitch advanced CSP and BGA packages, Loctite® 3536 is a high flow, lead-free compatible designed to quickly fill the space beneath the CSP and BGA packages. It cures rapidly at low temperature, which minimizes thermal stress to other components on the printed circuit board (PCB) and allows for in-line curing to increase device throughput.

Today's hand-held devices are subjected to many stresses and require reinforced mechanical strength for long-term reliability. Loctite 3536 delivers superior protection for solder joints against mechanical strains such as shock, drop and vibration and testing confirms its protective superiority over that of competitive materials. When evaluated against JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices, Loctite 3536 was proven to offer significant reliability improvements over non-underfilled Pb-free devices. The material also delivers exceptional manufacturing flexibility, as Loctite 3536 is compatible with lead-free solder materials to allow for an increased process window and is reworkable, enabling the recovery of expensive substrates and PCBs.

Though just officially launched to the marketplace this year, Loctite 3536 has already begun earning industry accolades with a recent Vision Award win recognizing the innovative features and profound manufacturing benefits of the material. "That Loctite 3536 won such a prestigious industry honor award after having been introduced so recently is a testament to Henkel's developmental approach and ability to produce market-ready, next-generation materials at a very accelerated pace," says Robert Chu, Henkel Global Product Manager for CSP Underfills. "We are very proud to have been selected as a Vision Award winner and are gratified that the judging panel recognized the outstanding performance and unique qualities of Loctite 3536."

The Vision Awards are an annual awards program sponsored by SMT magazine and recognize products for the electronics assembly industry that are truly innovative and present a real and relevant value to the marketplace. Evaluated by an expert panel of judges, Henkel's Loctite 3536 was chosen against other entries as the best new material in the category of Adhesives/Coatings/Encapsulants/Underfills.

"We recognize that cost-savings and production efficiencies are necessities for today's electronics firms," concludes Chu. "Like all Henkel materials, Loctite 3536 was formulated with these goals in mind and, clearly, the industry has validated our approach."

For more information please log on to www.henkel.com/electronics or call the company's Irvine, California headquarters at 949-789-2500.

About the electronics group of Henkel

Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics Industry.

Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal Care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. In fiscal 2005 Henkel generated sales of 11.974 billion euros. A leader in brands and technologies, Henkel makes people's lives easier, better, and more beautiful. More than 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".

Henkel Corporation
Doug Dixon
Phone: 949-789-2500
Fax: 949-785-2595

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