Ultratech Receives Multiple System, Follow-On Order for Fan-Out Wafer-Level Packaging Applications
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Ultratech's AP300 Lithography Systems will be used for Next-generation, High-volume, Fan-out Wafer-level Packaging Applications
SAN JOSE, Calif., June 28, 2016 - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received a multiple-system, follow-on order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems. The AP300 systems will be utilized for high-volume, fan-out wafer-level packaging (FOWLP) applications used to manufacture leading-edge chips. Ultratech will begin shipping the additional systems in the second quarter of this year to the customer's facility in Asia.
Ultratech General Manager and Vice President of Lithography Products Rezwan Lateef stated, "Fan-out technologies continue to be regarded as the optimal solution for the highly-demanding mobile and wireless markets. While traditional 3D techniques, such as TSV, are still too expensive for industry-wide adoption, FOWLP is being leveraged as a cost-effective packaging solution that delivers excellent performance and a small form factor. Ultratech's application-specific options for FOWLP lithography provide superior results to meet the challenges of fan-out wafer processing, such as die surface-to-mold non-planarity, die misalignment and wafer warpage. This follow-on order further confirms our technology leadership and the value proposition of our AP300 systems over full-field 1X scanners and reduction steppers. As we continue to build on our relationship with this valued customer, we look forward to supporting their aggressive technology roadmap which includes the utilization of interposers for high-end processors."
Ultratech's AP300 Family of Lithography Steppers
The AP300 family of lithography systems is built on Ultratech's customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost-effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech's award winning dual-side alignment (DSA) system, utilized around the world in volume production.
About Ultratech:
Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: frontÂend semiconductor, backÂend semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
CONTACT:
Company,
Bruce R. Wright,
Senior Vice President CFO,
Ultratech,
408/321-8835;
or
Suzanne Schmidt,
415/217-4962,
suzanne@blueshirtgroup.com,
or
Melanie Solomon,
415/217-4964,
melanie@blueshirtgroup.com,
Ultratech, Inc.
3050 Zanker Road,
San Jose,
CA,
95134,
United States
www.ultratech.com
