Thermal Reliability the Focus of Indium Corporation at Semi-Therm
Indium Corporation will present their Thermal Reliability Technology program at the Semiconductor Thermal Measurement, Modeling and Management Symposium and Exposition (Semi-Therm) on March 12-16, 2006 at the Hotel Intercontinental, Dallas, Texas USA.
With the increasing demands for power and miniaturization driving thermal management issues, Indium Corporation has developed a materials science program that addresses thermal performance concerns caused by increased power and reduced component size for Thermal Reliability. This comprehensive program focuses on the products, services, and technologies to support a Process Engineer's goal of optimizing finished goods reliability. Products featured at the show will include: Solder Thermal Interface Materials for heat dissipation, and Specialty Solders and Assemblies for hermetic package sealing, as well as die-attach solder and materials for MEMS, RF and Photonics. Indium's technologists and information will be available at booth #52.
Indium's Director of Solder Products, Ross Berntson, will also be serving as the Chair of the Thermal Materials Developments II session.
Semi-Therm provides attendees the opportunity to view the latest equipment and services related to thermal management and measurement. For more information visit www.semi-therm.org
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com/TIM
