Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

Manchester, NH – August 15, 2018 – SemiGen, Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.” 

The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure that the thermal flux from these devices is efficiently conducted to the heat spreaders and away from the transistor-gate regions.

The Tech Brief reviews the many challenges (often related to metal-quality and thickness) needing to be overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures. The brief also details the key factors in determining if a eutectic die-attach process is sophisticated enough to serve the mission-critical applications of today’s aerospace, military, Satcom, and telecommunications applications.

SemiGen is a trusted manufacturing partner that has aided many customers in developing these precision eutectic die-attach processes. The result is repeatable ultra-reliable die-attach for their devices that are routinely deployed in critical, hi-rel land, sea, air, and space missions around the globe.

To learn more, download the full tech brief at www.semigen.net/download-eutectic-die-attach-of-gan-andgaas-mmics. 

About SemiGen | www.semigen.net

SemiGen is a leading RF/microwave solutions company that provides manufacturing services and products to fill the voids in the supply chain and manufacturing floor. SemiGen’s design and manufacturing center includes RF/microwave assembly, PCB, box build, module repair and test services coupled with the semiconductor devices and manufacturing supplies needed for successful products in the RF/Microwave hybrids and components. Their team helps with designs, builds prototypes, and handles volume production runs for the RF/microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their 17,000 square foot facility includes a class 10,000 clean room and offers manual to full automatic assembly for any manufacturing challenge. The company was founded in 2009 and is based in Manchester, NH.

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