Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies

Manchester, NH – August 15, 2018 – SemiGen, Inc. (, an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.” 

The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure that the thermal flux from these devices is efficiently conducted to the heat spreaders and away from the transistor-gate regions.

The Tech Brief reviews the many challenges (often related to metal-quality and thickness) needing to be overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures. The brief also details the key factors in determining if a eutectic die-attach process is sophisticated enough to serve the mission-critical applications of today’s aerospace, military, Satcom, and telecommunications applications.

SemiGen is a trusted manufacturing partner that has aided many customers in developing these precision eutectic die-attach processes. The result is repeatable ultra-reliable die-attach for their devices that are routinely deployed in critical, hi-rel land, sea, air, and space missions around the globe.

To learn more, download the full tech brief at 

About SemiGen |

SemiGen is a leading RF/microwave solutions company that provides manufacturing services and products to fill the voids in the supply chain and manufacturing floor. SemiGen’s design and manufacturing center includes RF/microwave assembly, PCB, box build, module repair and test services coupled with the semiconductor devices and manufacturing supplies needed for successful products in the RF/Microwave hybrids and components. Their team helps with designs, builds prototypes, and handles volume production runs for the RF/microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their 17,000 square foot facility includes a class 10,000 clean room and offers manual to full automatic assembly for any manufacturing challenge. The company was founded in 2009 and is based in Manchester, NH.

More from Packaging Products & Equipment

All Topics