WHEELING, ILL., March 11, 2011-Engis Corporation, a leading provider of complete superabrasive finishing solutions for lapping, honing, polishing and grinding, today announced expansion plans that will nearly double the size of its world headquarters in Wheeling, Ill., a Chicago suburb. The company will expand its state-of-the-art manufacturing and warehouse facilities and create space for the new Engis Technology Center.
The 54,000-sq.-ft., multi-million-dollar expansion will bring total space to 121,500 sq. ft. and enable the company to consolidate all engineering, process development labs, manufacturing, warehousing and administrative offices into a single facility. In conjunction with this project, Engis will add new manufacturing, process development and testing and measurement equipment. Construction will start in April and be complete by fall of 2011.
"This expansion demonstrates our long-term commitment to customers as a leading-edge provider of superabrasive solutions," says Stephen Griffin, president of Engis Corporation. "For example, new automated manufacturing equipment will enable us to increase our ability to support global markets, while the Engis Technology Center will enhance our capability to develop turnkey manufacturing solutions. It also demonstrates our commitment to keep and generate future jobs in Wheeling and in the United States."
Engis is a provider of micronized diamond, cubic boron nitride (CBN) powders, slurries, compounds, grinding wheels, machine tools and accessories. It is especially known for its "systems approach" that combines product and process knowledge to develop complete solutions to improve part quality, lower cost and reduce cycle times.
The cornerstone of the expansion project will be the new Engis Technology Center, where the company works hand-in-hand with customers to finish components to nanometer tolerances and achieve mirror surfaces. The Center will house five labs:
o The Process Development Lab (PDL), which provides assistance for general industrial lapping and polishing inquires.
o The Wafer Process Lab (WPL), which serves the advanced material and compound semiconductor markets.
o The Hard Disk Drive (HDD) Lab, which focuses on the needs of the data storage industry.
o The Diamond Characterization Lab (DCL), which also includes the Engis' Metrology (measurement) Lab.
o The Bore Finishing Lab (BFL), which works closely with customers on honing and bore finishing applications in the automotive, hydraulic, medical, advanced ceramic, compressor, aerospace and defense industries.
"Consolidating all the labs in one location will enable us to concentrate our engineering resources and enhance our customer service activities," says Griffin.
Engis currently leases space for some of its process labs and other activities at a nearby location. All of these operations will be incorporated into the new expansion.
Engis Corporation, headquartered in Wheeling, Ill., is a leading worldwide provider of superabrasive finishing systems and HYPREZ high precision micron diamond and CBN powders. Engis solutions include grinding, honing, lapping and polishing products, as well as fully configured, custom-developed manufacturing systems. Industries served include oil & gas, electronics, semi-conductor, medical devices, aerospace, defense, ceramics, mold/tool/die, automotive, mechanical valves/seals, foundries and more. A privately held company, Engis employs approximately 140 people in Illinois and 200 worldwide, which includes five locations in Asia, one in Europe and one in Canada.
For more information, visit Engis' Web site at www.Engis.com or call 800-993-6447 or +1-847-808-9400, e-mail firstname.lastname@example.org, fax +1-847-808-9403 or write to Engis Corporation, 105 West Hintz Road, Wheeling, IL, 60090.