S-Bond Technologies Produces Their New Website to Introduce New Capabilities in the Bonding Services & Active Solder Industry
S-Bond Technologies in Lansdale, PA has developed a new website to fully explain our products & services. At the core of all SBT products and bonding services is its Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements which create a more chemically reactive solder that forms a bond with surfaces, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the surface.
Our solutions include manufactured components including Aluminum Structures, Sputter Targets, Sensors, Housings, Windows & Feedthroughs, Advanced Thermal Management, Heat Sinks / Cold Plates, Electronic Packaging, and Direct Die Attachments.
Our new website includes the capability to search by industry, by product, details prototype development and our technology and gives the opportunity to send an RFQ. For more information, please see www.s-bond.com
About Us: Since 1996, S-Bond Technologies has helped customers solve difficult joining problems. Using our quality manufacturing facilities in Lansdale, PA or in processes adapted in your facilities, S-Bond® products provide reliable high strength hermetic bonds between a wide variety of dissimilar materials.
Our engineers, technicians, and scientists are experienced with all aspects of joining and assembly processes, as well as the design requirements for many varied applications.
S-Bond products join metals, ceramics, piezo-electric ceramics, silicon and other semiconductors, glasses, and carbon materials such as diamond and graphite. The wide range of materials joined with our lead-free and fluxless active solders make S-Bond the choice for many applications. S-Bond is a bonding technology that employs our patented active solders which contain Ti and rare earth elements in combination with base solder alloys. Using our expertise in Active Solder Technology, we have developed a range of solutions that allow the cost effective assembly of unique combinations of materials without plating or fluxes. Examples include copper to aluminum and graphite to aluminum for thermal management systems, sapphire to metal for lightweight sensor assemblies, and silicon carbide to titanium and other metals for lightweight armor and wear resistant surfaces. SBT offers a range of products and services to suit your development and production assembly needs.
Please contact Ron Smith for more information rsmith@s-bond.com, call 215-631-7114 or visit our website www.s-bond.com
