Palomar Wins Global Technology Award for its Precision Gold Wire Bonder and Ball Bumper
Carlsbad, Calif. - December 20, 2005 - Palomar Technologies, leader in precision automation equipment and process development for microelectronic assembly, announced it has received a 2005 Global Technology Award. The award is given by Global SMT & Packaging magazine to recognize the best new innovations in the printed circuit assembly and packaging industries. Palomar won the award for its Model 8000 gold wire bonder and gold ball bumper. The award was presented at a ceremony held during Productronica in Munich, Germany on November 16, 2005.
The Model 8000 is a gold ball-and-stitch thermosonic wire bonder for complex, precision interconnects where flexibility, ease of programming, and high throughput are desired. Applications such as complex multichip applications, high I/O count devices, and gold ball bumping for flip chip, MEMS, and high frequency, fine pitch applications are addressed by the Model 8000. Palomar's single process co-planar gold bumper is the only machine that can produce planarized (bumps with a flat top and consistent programmable height) gold bumps in one step. An industry-best finished bond height consistency of +2 microns (at 3 sigma) is achieved with 2.5-micron placement accuracy. Additionally, gold wires and gold bumps provide a viable interconnection alternative where lead-free processes are mandated.
"This was the first year of the Global Technology Awards and we were surprised by the large number of entries," said Global SMT & Packaging editor-in-chief Trevor Galbraith. "We had judges from China, Europe and the United States. It was truly an international awards contest celebrating the best technologies in the electronics industry."
We were very pleased to receive this Global Technology Award for our Model 8000 gold wire bonder and ball bumper and we want to thank Trevor and his staff at Global SMT and Packaging for their diligent work putting this award competition together," said Palomar Technologies COO Bruce Hueners. "This is one of several awards the Model 8000 has received this year, providing ample evidence of the high quality and unique features it offers to companies requiring accuracy, precision, and low cost of ownership for their ball bumping and wire bonding applications.
About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronics, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, medical and RF/ID industries and markets.
Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production.
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Palomar Technologies, Inc.
Tricia McGough
Phone: (760) 931-3440
Fax: (760) 931-5191
tmcgough@bonders.com
Palomar Technologies Pte Ltd
Wai Seng Chew
Phone: (65) 6779 2766
Fax: (65) 6779 7939
wschew@bonders.com
Palomar Technologies GmbH
Josef Schmidl
Phone: 49 (9131) 48009-30
Fax: 49 (9131) 48009-55
jschmidl@bonders.com
A·R Marketing, Inc.
Andrea Roberts
Phone: (858) 451-8666
aroberts@san.rr.com
