SAN JOSE, CALIF. (PRWEB) MAY 29, 2019 - NexLogic Technologies, Inc. has announced it has completed its microelectronics manufacturing infrastructure with the purchase of new CAPEX equipment. These newest acquisitions finalize all the services and systems required to provide a comprehensive PCB Microelectronics manufacturing. NexLogic’s PCB hybrid manufacturing combines both traditional SMT manufacturing and microelectronics manufacturing that involves flip chip, chip on board (CoB), and wire bonding.
NexLogic President and Founder, Zulki Khan said, “We are extremely gratified that we are at the forefront of this technology. This means we can offer our existing and new manufacturing customers a comprehensive range of services and technologies to help make their PCB projects highly successful. With the addition of these new pieces of equipment, we now have all the tools at our disposal to perform wire, wedge, ball/stud bonding, die attach, and encapsulation.”
The two final pieces of equipment rounding out NexLogic’s microelectronics manufacturing ecosystem are a Kulicke & Soffa (K&S) IConn MEM Plus ™ high-performance ball bonder and a Nordson EFD precision fluid dispenser system.
The K&S system is designed for gold and silver alloy wire and ball bonding. This bonding system delivers high quality and productivity benefits in complex multi-die stack package applications. It features advanced process, looping, overhang control and ease of use on the NexLogic manufacturing floor.
The Nordson EFD dispenser system with E3V Robotic based Auger dispensing capabilities to precisely dispense either epoxy, paste or any other kind of semi-fluids in the very tight and controlled spaces required in microelectronics manufacturing. This dispenser system can also be used for eutectic die attach, silver epoxy dispensing placements, or for paste placement of different types.
Over the last year, NexLogic has made CAPEX investments including a new Class 10,000 cleanroom and has hired fully trained personnel to comply with this growing industry demand for precise microelectronics manufacturing. The two new pieces of equipment complement an existing manufacturing floor that includes Hesse Bondjet 820 fully automatic fine wire bonders, MRSI 705 Systems, a Janome JR3303 Robotic level flux and epoxy dispenser, TPT-HB16 Wire/Ball Bonder, Royce 620 Multi-test Bond Tester and sheer strength puller, and Keyence VK-X1000 Profile Measurement Microscope for wire bond inspection and verification.
About NexLogic Technologies, Inc. 1995-2019
24th anniversary year and selected among the Top 10 EMS Providers in Silicon Valley
An ISO 9001:2008, ISO 13485 Certified, and RoHS compliant EMS provider, NexLogic is a leading electronic manufacturing services provider that offers total integrated circuit board solutions. The company was established in 1995 and serves over 200 customers in North America. NexLogic’ s mission is to be the best electronic manufacturing services (EMS) provider to the markets it serves through high quality and an efficient manufacturing process.