Molex to Showcase Innovative Interconnect Solutions at X-Fest, Sponsored by Xilinx and Avnet

Molex, Inc. Oct 13, 2009

Molex SEARAY(tm) connector meets the VITA 57 FPGA Mezzanine Connector (FMC) Standard.

LISLE, Ill. October 6, 2009 - Molex Incorporated (NASDAQ: MOLX and MOLXA) will showcase innovative interconnect solutions at leading technology distributor Avnet's X-Fest, which includes more than 30 full-day events around the globe and is sponsored by Xilinx, a global leader in programmable logic solutions. During the events, Molex will showcase solutions including the Molex SEARAY* board-to-board connector, which meets the VITA 57 FPGA Mezzanine Connector (FMC) standard and is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PCBs.

X-fest events will be hosted in 37 locations throughout Asia, Europe, North America and Japan from October 2009 through February 2010. The global series of free technical seminars will offer practical, how-to training for designers interested in using the new Spartan(r)-6 and Virtex(r)-6 FPGA families from Xilinx. X-Fest full-day events will showcase innovative design techniques, methodologies and implementations as well as reference designs from multiple manufacturers that can accelerate myriad applications from PCIe to video to wireless to embedded networking and more.

"As a leading supplier of interconnect solutions, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life," said Jim Kruzich, distribution corporate accounts manager, Molex Incorporated. "Our portfolio is among the world's largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling. The Molex and Avnet partnership will continue to provide these solutions to our customers around the world well into the future."

At X-Fest, Molex will feature the following product categories:

Backplane: Molex offers a variety of high signal integrity backplane/midplane solutions to meet the demand for increased network bandwidth and advanced technology. From data rates of 5 Gbps to 25 Gbps and any speed in between, Molex has a backplane solution for every application.

Power: Molex's diverse selection of power connectors offers current ratings up to 150 amps per circuit. Molex's EXTreme Power(tm) family offers high-current interconnect solutions with best-in-class power densities. The extensive product offering ranges from EXTreme MicroPower(tm) 16.0A blades to EXTreme PowerMass(tm) 150.0A modules.

High Speed I/O: Molex has an extensive line of high-speed, high-density I/O products to meet today's rigorous interconnect requirements. Molex is setting the standard for many I/Os of the future through active participation in standards committees and working groups such as SAS, SATA, PCIe, HSSG, Fibre Channel, InfiniBand, IEC, CEA, DDWG, IEEE, VESA, USB and many more.

High Speed Edge Card: Molex High Speed Edge Card Connectors offer multiple features and mating options for vertical, right angle and mid-plane PCB orientations. New, efficient contact designs in various circuit sizes provide excellent signal integrity at 12.5 Gbps data rates and beyond, as well as up to 1.5 amps per circuit of power.

Board-to-Board: For board-to-board design configurations, Molex has an array of SMT and through-hole products to meet nearly any design challenge. Molex has the solution for whatever board-to-board design is required - from a microminiature connector like our 0.40mm SlimStack(tm) line to a high-density, high-performance mezzanine connector such as the SEARAY family.

Off-the-Board: When it comes to wire-to-wire and wire-to-board configurations, Molex meets almost any application requirement with a range of products, from microminiature FFC/FPC connectors to the sealed MX150(tm) family and power families such as Micro-Fit 3.0(tm) and Mini-Fit(r).

For more information on these products, please visit www.molex.com. For more information on X-Fest, please visit http://weboom.com/avnet/index.html.

About Molex Incorporated
Molex Incorporated is a 71-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 43 manufacturing locations in 18 countries. The Molex website is www.molex.com.

Molex is a registered trademark of Molex Incorporated.
*SEARAY is a trademark of Samtec Inc.
Spartan and Virtex are registered trademarks of Xilinx.
EXTreme Power, EXTreme MicroPower, EXTreme PowerMass, SlimStack, MX150 and Micro-Fit 3.0 are trademarks of Molex Incorporated.
Mini-Fit is a registered trademark of Molex Incorporated.