Kulicke & Soffa Closes Purchase of Alphasem, Expanding Its Equipment Segment


Fort Washington, PA-November 6, 2006-Kulicke & Soffa Industries, Inc. (the "Company") (Nasdaq: KLIC) today closed the previously announced purchase of Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International, Inc., a subsidiary of Dover Corporation. The purchase price was $27.1 million in cash, after a working capital adjustment and subject to further post closing adjustments.

Scott Kulicke, K&S chairman and chief executive officer, commented on the acquisition, "We had identified die bonding equipment as a natural growth path for K&S. The Alphasem purchase is the most attractive way for us to enter that market. Alphasem has good position in the die bonder market, serving a wide range of applications. Their line of products fulfills the market needs for leading edge technology and cost efficient solutions across a variety of package types."

He concluded, "This acquisition is a step forward in our strategy to extend our core products and technologies. K&S is enthusiastic about entering the die bonder market. We believe this acquisition will bring real value to the Company and to our shareholders, as we expand the K&S role in the semiconductor assembly process."

About Alphasem
Alphasem is a leading supplier of die bonder equipment. According to the most recent VLSI Research market data report, Alphasem held a 10% share of the $520 million die bonder market in calendar year 2005. Alphasem generated sales of approximately $60 million in calendar 2005 for die bonders, related materials, and services, with 260 employees.

About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor assembly equipment, materials, and technology. K&S provides wire bonders, capillaries, wire, and die bonders for all types of semiconductor packages using wire as the internal electrical interconnections. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor assembly equipment along with the complementing packaging materials and process technology that enable our customers to achieve the highest possible yields and throughput. The ability to provide these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is www.kns.com.

K&S Contact:
Michael Sheaffer,
215-784-6411,
215-784-6167 fax,
msheaffer@kns.com

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