Press Release Summary:
The IPC selected best technical paper based on the voting through ballot process by the members of IPC APEX EXPO Technical Program Committee. The winning paper’s title is “Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns” and was written by Chen Xu, Nokia. The paper will be presented during technical conference session 36 on Thursday, January 31. The technical papers are evaluated based on technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.
Original Press Release:
Best Technical Paper at IPC APEX EXPO 2019 Selected
BANNOCKBURN, Ill., USA, December 18, 2018 — The best technical conference paper of IPC APEX EXPO® 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Taking top honors, the winning paper is, “Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns” by Chen Xu, Nokia. His co-author was: Jason Stafford, Imperial College London. This paper will be presented during Technical Conference Session 36 (Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion) on Thursday, January 31.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Head-on-Pillow Defect Detection – X-ray Inspection Limitations” by Lars Bruno, Ericsson AB. His co-author was: Benny Gustafson, Ericsson AB. This paper will be presented during Technical Conference Session 3 (Assembly/Inspection -- BTC/ BGA) on Tuesday, January 29.
Honorable mention also goes to “Analyzing a Printed Circuit Board with Oxide Residue Contamination” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Andrew Dineen; Hailey Jordan; Curtis Leonard, The Charles Stark Draper Laboratory, Inc.; and Edward Arthur, Raytheon Company, Space and Airborne Systems. This paper will be presented during Technical Conference Session 25 (Failure Analysis) on Wednesday, January 30.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place including standards development committee meetings, professional development courses, the exhibition and more, visit www.IPCAPEXEXPO.org.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,900 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.