IPC Presents Special Recognition and Distinguished Committee Service Awards
Press Release Summary:
IPC honored leadership awards to individuals who made significant contributions to IPC and the industry on October 15 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. Nearly 100 awards were presented at Fall Standards Development Committee Meetings. The leadership awards are given for 22AS and 5-22AD task groups, 7-31FS task group, 2-19B Trusted Supplier Task Group. Mike Carano was awarded for V-TSL technology solutions and Mike Bryant for 3-12d Woven Glass Reinforcement tasks group.
Original Press Release:
Volunteers Honored for Contributions to IPC and the Electronics Industry
Nearly 100 Awards Presented at Fall Standards Development Committee Meetings
BANNOCKBURN, Ill., USA, October 19, 2018 — IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on October 15 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
For their leadership of the 22AS and 5-22AD Task Groups that developed IPC J-STD-001GS, Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G, Dan Foster, Missile Defense Agency; Kathy Johnston, Raytheon Missile System; Gary Latta, SAIC; and Garry McGuire, NASA Marshall Space Flight Center were honored with a Committee Leadership Award. For their extraordinary contributions to IPC J-STD-001GS, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Roger Smith, Naval Surface Warfare Ctr.; and Jonathan Vermillion, Ball Aerospace & Technologies Corp., received a Special Recognition Award. Erik Bjerke, BAE Systems; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; James Daggett, Raytheon Company; James Saunders, Raytheon Company; Bhanu Sood, NASA Goddard Space Flight Center; Charles Gamble, NASA Marshall Space Flight Center; and Stefan Hanigk, Ariane Group GmbH, received a Distinguished Committee Service Award for their contributions to IPC J-STD-001GS.
For their leadership of the 7-31FS Task Group that developed IPC/WHMA-A-620C-S, Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C, Garry McGuire, NASA Marshall Space Flight Center and George Millman, Raytheon Missile Systems, earned a Committee Leadership Award. For their contributions to IPC/WHMA-A-620C-S, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; and Jonathon Vermillion, Ball Aerospace & Technologies Corp., earned a Special Recognition Award. A Distinguished Committee Service Award was presented to Chris Fitzgerald, Nasa Goddard Space Flight Center; Charles Gamble, NASA Marshall Space Flight Center; and John Mastorides, Honeywell Aerospace, for their contributions to IPC/WHMA-A-620C-S.
Mike Carano, RBP Chemical Technology, Inc., was honored with a Committee Leadership Award for leading the V-TSL Technology Solutions Committee that developed IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat. Marc Carter, SAIC; Dennis Fritz, SAIC; Jeff Harms, Naval Surface Warfare Center; Happy Holden, Ted Jones, Naval Surface Warfare Center; Jerry Magera, Motorola Solutions; J.R. Strickland, Motorola Solutions; Joseph Fjelstad, Verdant Electronics; and Hardeep Heer, Firan Technology Group (FTG), received a Distinguished Committee Service Award for their contributions to IPC-WP-023.
For his leadership of the 2-19B Trusted Supplier Task Group that developed IPC-1791, Trusted Electronic Designer, Manufacturer and Assembler Requirements, Richard Snogren, Bristlecone LLC, earned a Committee Leadership Award. Peter Bigelow, IMI Inc.; Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati; Stephanie Brockway, DASD(SE) Systems Engineer; Marc Carter, SAIC; Don Dupriest, Lockheed Martin Missiles & Fire Control; Dennis Fritz, SAIC; Mark Kirkman, SAIC; Vijay Kumar, Lockheed Martin Missile & Fire Control; William May, NSWC Crane; Karen McConnell, Northrop Grumman Corporation; Mark McMeen, STI Electronics, Inc.; Dr. Thi Nguyen, Lockheed Martin Missile & Fire Control; Douglas Schueller, AbelConn; Ray Shanahan, ODASD(SE); Roger Smith, NSWC Crane; Steve Vetter, NSWC Crane; Anne Bennedsen, GDCA, Inc.; Aman Gahoonia, Defense Microelectronics Activity; Robert Irie, OSD AT&L MIBP; Suriyaken Kleitz, Schlumberger Well Services; Tim Koczanski, Defense Logistics Agency; Vicki Michetti, U.S. Department of Defense; David Pentrack, Defense Microelectronics Activity; Ethan Plotkin, GDCA, Inc.; Lowell Sherman, DLA Land and Maritime; and John Timler, SAIC, received a Distinguished Committee Service Award for their contributions to IPC-1791.
For his leadership of the D-13 Flexible Circuits Base Materials Subcommittee that developed IPC-4203, Cover and Bonding Material for Flexible Printed Circuitry and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards, Clark Webster, ALL Flex LLC, earned a Committee Leadership Award. A Distinguished Committee Service Award was presented to Michael Collier, Teledyne Advanced Electronic Solutions; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Nick Koop, TTM Technologies; Dr. Thi Nguyen, Lockheed Martin Missile & Fire Control; Doug Sober, Essex Technologies Group Inc.; Mark Finstad, Flexible Circuit Technologies, Inc.; Scott Herrmann, Dupont; and Brian Stevens, Rockwell Collins, for their contributions to IPC-4203 and IPC-4204.
Mike Bryant, BGF Industries Inc., was honored with a Committee Leadership Award for leading the 3-12d Woven Glass Reinforcement Task Group, IPC-4412B, Specification for Finished Fabric Woven from "E" Glass for Printed Boards. Masahiro Awano, Nitto Boseki; Jiam Wei Cai, Shengyi Technology Co., Ltd.; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Kohji Hattori, Unitika Glass Fiber Co.,Ltd; Scott Hinaga, Cisco Systems Inc.; Bill Ortloff, Raytheon Company; Doug Sober, Essex Technologies Group Inc.; Bhanu Sood, NASA Goddard Space Flight Center; Curtis Carter, Saint-Gobain Vetrotex America; Doug Leys, Nelco Products Inc.; and David Wynants, Taconic Advanced Dielectric Division, received a Distinguished Committee Service Award.
For their leadership of the 5-33g Low Pressure Molding Task Group, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, Russell Steiner, Casco Products and Eric Camden, Foresite, Inc., earned a Committee Leadership Award. For their extraordinary contributions to IPC-7621, Fernando Cutino, Allegion; Jason Keeping, Celestica; Donald McCreary, Allegion; Joseph Montella, GHSP, Inc.; William Pfingston, Miraco, Inc.; and Callum Poole, Henkel Corporation, received a Distinguished Committee Service Award.
For more information on these awards or the award recipients, contact Sandy Gentry, IPC communications director, at +1 847-597-2871.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Contact:
Sandy Gentry, IPC Communications Director
+1 847-597-2871 or SandyGentry@ipc.org
