IPC Calls for Submissions of poster abstracts for IPC APEX EXPO.
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Press Release Summary:
IPC — Association Connecting Electronics Industries® invites researchers, technical experts, and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®. Technical poster presentations, which are being sought on relevant electronics topics, including design, materials, assembly, processes, and equipment, are scheduled for February 15, 2017 and will be displayed throughout said event. Abstracts of up to 300 words should be submitted by October 22, 2016.
Original Press Release:
IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2017 in San Diego
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment, especially:
• 3D Printing in Electronics Manufacturing
• Automation in Electronics Manufacturing
• Adhesives
• Advanced Technology
• Area Array/Flip Chip/0201 Metric
• Assembly and Rework Processes
• BGA/CSP Packaging
• Black Pad and Other Board Related Defect
 Issues
• BTC/QFN/LGA/MLF Components
• Business & Supply Chain Issues
• Cleaning
• Conformal Coatings
• Corrosion
• Counterfeit Electronics
• Design
• Electromigration
• Electronics Manufacturing Services
• Embedded Passive & Active Devices
• Environmental Compliance
• Graphene in Electronics Manufacturing
• Lean Six Sigma
• LED Manufacturing
• Failure Analysis
• Flexible Circuitry
• HDI Technologies
• Head-on-Pillow • Board and Component Warpage
• High Speed, High Frequency & Signal
 Integrity
• Industry 4.0
• Lead-Free Fabrication, Assembly &
 Reliability
• Miniaturization
• Nanotechnology
• Optoelectronics
• Packaging & Components
• PCB Fabrication
• PCB and Component Storage & Handling
 Performance
• Quality & Reliability
• Photovoltaics
• PoP (Package-on-Package)
• Printed Electronics
• Reshoring
• RFID Circuitry
• Robotics
• Soldering
• Surface Finishes
• Test, Inspection & AOI
• Tin Whiskers
• 2.5-D/3-D Component Packaging
• Underfills
• Via Plugging & Other Protection
• Wearables
An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by October 22, 2016, to http://www.IPCAPEXEXPO.org/CFPosters.
For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
