Indium Corporation VP of Technology to Lead High-Reliability Solder Materials Workshop at LED A.R.T. Symposium

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at the LED Assembly, Reliability & Testing Symposium in Atlanta, Georgia on Dec. 1.

As the electronics industry rapidly advances toward miniaturization, two drivers dictate manufacturer success: low-cost and high-reliability. This course examines the roles of solder composition on cost and reliability, including a review of material properties, soldering performance, known failure modes, and the primary merits of alloys.

Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation,

visit www.indium.com or email abrown@indium.com.

Contact:

Anita Brown,

Corporate Communications

Indium Corporation

abrown@indium.com

tel: +1.315.381.7524 34

Robinson Road Clinton, NY 13323 USA

www.indium.com

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