Indium Corporation to Feature WEEE/RoHS Compliant Materials at Productronica
Indium Corporation will be exhibiting its Suite of Pb-Free Electronics Assembly Materials for WEEE and RoHS compliance at the Productronica show in Munich, Germany on November 15-18, 2006. Held only every other year, Productronica is the world's leading trade show for electronics production, with almost 43,000 visitors from 88 different countries. Indium will be located in booth A3-550.
Indium's exhibit will offer a full range of Pb-Free assembly materials, including the first Reworkable Pb-Free No-Flow Underfill (NF-260) and its newest No-Clean Solder Paste (Indium5.1) with its industry leading response-to-pause printing. In addition, Indium will also feature other Pb-Free materials, such as Water-Wash Solder Pastes (Indium3.1), Solder Preforms in Tape & Reel Packaging, Wave Solder Flux for Pb-Free mixed-technology, and Rework & Repair materials.
Indium's Pb-Free Suite of materials is backed by an award-winning Research & Development team and an experienced Pb-Free Implementation Support Center offering process proven solutions and staffed with one of the largest SMTA-Certified teams in the industry.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about other trade shows at which Indium Corporation will be exhibiting, visit www.indium.com
