Indium Corporation to Display at IMAPS Device Packaging Conference and Exhibition
Date: March 9, 2006
Indium Corporation will exhibit at the IMAPS International Conference and Exhibition on Device Packaging on March 20-23, 2006 in Scottsdale, Arizona. The conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase.
Indium's exhibit will focus on Wafer and Chip Bumping, Semiconductor Packaging Materials, and Specialty Solder and Assemblies, including solder wire, solder preforms, and solder paste.
Indium Corporation will be exhibiting at booth #35.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com or email askus@indium.com.
Contact:
Anita Brown, Corporate Communications
Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Clinton, NY 13323 USA
www.indium.com
