Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo.
Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes:
- Are designed to provide ultra-low voiding
- Offer great print capabilities for small and low profile components
- Are designed to overcome head-in-pillow (HIP)
- Have excellent shelf and stencil life
“These industry-proven products satisfy a wide range of critical engineering requirements, as opposed to the single-purpose solutions you see on the market,” said Pat Ryan, America’s Sales Manager.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
34 Robinson Road
Clinton, NY 13323