Indium Corporation Technology Experts Presenting at SMTA International
Five of Indium Corporation's technology experts will be presenting their technical findings at SMTA International (SMTAI), October 4 - 8, 2009, at The Town and Country Resort and Convention Center, San Diego, CA.
o Ning-Cheng Lee, Ph.D, Vice President of Technology
o Ronald C. Lasky, Ph.D. PE, Senior Technologist
o Eric Bastow, Senior Technical Support Engineer
o Chris Anglin, Applications Development Engineer
o Jim Hisert, Applications Engineer
Dr. Lee is presenting three papers: Lead-Free Flux Technology and Influence on Cleaning; Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era, co-authored with Yan Liu, Ph.D. and Runsheng Mao, Ph.D., Indium Corporation; and Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control, co-authored with Mike Bixenman, DBA, Kyzen Corporation. Dr. Lee is also chairing the session on Thermal Management Innovations.
Dr. Lasky is presenting a paper he co-authored with Ed Briggs, Indium Corporation, called Best Practices Reflow Profiling for Lead-Free SMT. Dr. Lasky is also presenting SMT: The Next 25 Years as part of the anniversary dinner celebration and chairing the event Alternative Lead-Free Alloys.
Eric Bastow is presenting a paper he co-authored with Tim Jensen called The Proliferation of Pb-Free Alloys.
Chris Anglin is presenting a paper he co-authored with Dave Sbiroli, Indium Corporation; George Babka, Assembléon America, Inc.; and Richard Brooks, Christopher Associates, called Sustaining a Robust Fine Feature Printing Process.
Jim Hisert is presenting a paper he co-authored with Brandon Judd, Indium Corporation, called Next Generation PoP Pastes for Electronics Assembly.
In addition, two of Indium Corporation's Research Scientists are presenting their iNEMI
project reports. Runsheng Mao is presenting a Step Stencil Printing Study for the Solder Paste Deposition Project and Weiping Liu is presenting Thermal Fatigue Experiments and Alloy Test Requirements as a part of the Lead-Free Alloy Alternatives Project Report.
Indium Corporation is also exhibiting at the Electronics Exhibition at booth #609.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is also a member of the SMTAI planning committee.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at www.indium.com/drlasky.
Eric Bastow joined Indium Corporation in 2001 developing new solder paste flux chemistries under the direction of Dr. Ning-Cheng Lee. He also gained experience performing residual gas analysis of hermetic electronic packages and developing electroless nickel-plating bath chemistries. Eric is an SMTA-certified process engineer (CSMTPE) and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He has an associate's degree in Engineering Science from the State University of New York and has authored several technical papers and articles.
Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master's degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.
Jim Hisert has a bachelor's degree in Mechanical Engineering Technology from the State University of New York Institute of Technology and is a member of the American Society of Mechanical Engineers. He is especially knowledgeable in the area of precision flux application and his expertise in semiconductor packaging has helped numerous companies to advance in this area. Jim has presented at various industry organizations and technical seminars and has authored technical papers on thermal management as well as semiconductor packaging assembly. In addition, he was awarded the Silver Quill award for his educational and instructive "Thermal Interface Materials" presentation.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA - the world's leading user group for surface mount and companion technologies. This comprehensive event features over 100 technical papers, 24 tutorials, an Alternative Energy Symposium, and three focused symposia across six tracks: Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Process Control, and Contract Manufacturing/Business Issues.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication & packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner, and registered to ISO-9001.
For more information about SMTAI or to register for these conferences, visit
http://www.smta.org/smtai
For more information about Indium Corporation, visit www.indium.com or email
abrown@indium.com.
Contact:
Anita Brown,
Corporate Communications
Indium Corporation
abrown@indium.com
tel: +1.315.381.7524
34 Robinson Road
Clinton, NY 13323 USA
www.indium.com
