Indium Corporation Technologists to Present at IPC/APEX & Designers Summit


Pb-Free will be the focus of courses by Indium Corporation's Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., at the IPC/APEX and Designers Summit in Anaheim, California on February 7, 2006.

Dr. Ning-Cheng Lee is presenting a full day professional development course from 8:30 a.m. to 4:30 p.m. called Lead-Free Soldering - Metallurgical Fundamentals, Reflow Applications and Challenges. This course will focus on the fundamental design considerations for Pb-Free alloys and with emphasize on metallurgical properties analysis. Dr. Lee will also discuss major challenges to Pb-Free soldering, focusing on metallurgical causes.

Dr. Lasky will present two half-day professional development courses, one from 9:00 a.m. to 12:00 p.m. called A Protocol for WEEE and RoHS Compliance, and one from 2:00 p.m. to 5:00 p.m. called Best Practices in Implementing Lead Free Assembly: 2006. The morning session will talk about the need for a systematic approach to meeting the WEEE and RoHS challenges, offering a protocol that will help companies prepare for this upcoming legislation. The afternoon session focuses on the "how-to" of implementing Pb-Free. It covers issues such as PWB finishes, components, alloys, and SMT processes. It will also review actual implementations of Pb-Free assembly with a significant amount of data presented on process and product reliability.

Dr. Lee, SMTA Member of Distinction, has more than 20 years of experience in the development of fluxes and solder pastes for SMT applications. In addition, he has very extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 20 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information about Indium Corporation visit www.indium.com or email askus@indium.com.

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