Indium Corporation Hosts Global Technical Summit 2006
Indium Corporation hosted its 4th Annual Global Technical Summit for their Technical Support and Applications Engineers in Clinton, NY, September 11-15th. Over 40 attendees from Asia, Europe, Mexico, and the United States participated.
The Technical Summit provided an opportunity for Indium's global network of technical engineers to learn about new products, current research, and break-through developments in the industry, as well as to present case studies, share expertise, and network with each other.
The agenda also included presentations by Dr. Claudius Ferger, Manager of Advanced Plastic Packaging at IBM's Thomas J. Watson Research Center, Dr. Ning-Cheng Lee, Vice President of Technology at Indium Corporation, and Dr. Ronald C. Lasky, Senior Technologist at Indium Corporation.
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics and semiconductor assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com -http://www.indium.com/ or email askus@indium.com.
Contact:
Anita Brown, Corporate Communications
Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502
www.indium.com
